Location-controlled grains with a diameter of 4 μm are successfully prepared by excimer laser crystallization of sputtered α-Si with μ-Czochralski (grain filter) process at a maximum processing temperature of 100°C. By a pulsed DC magnetron sputtering, α-Si film is deposited firstly on non-structured oxidized wafers for a test. It is found that a-Si film is easily ablated even with a low laser fluence when it is deposited with a substrate bias. From a non-biased sputtered α-Si precursor, grains with 1.8 mm in diameter can be prepared with excimer laser crystallization at room temperature. α-Si is then sputtered on the SiO2 with narrow holes (grain filters) and crystallized at room temperature. The location-controlled grains can be successfully prepared in a large energy density window. These location-controlled grains with a low temperature process are promising for single-grain thin film transistors (TFTs) on plastic substrate for an application to system integration on flexible microelectronics.