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1 results

  • Measurement of Low-k Polymerimetal Interfacial Toughness Using 4-point Bending Method

  • Qing Ma, Chuanbin Pan, Harry Fujimoto, Baylor Triplett, Peter Coon, Chien Chiang
  • Journal:
    MRS Online Proceedings Library Archive / Volume 436 / 1996
    Published online by Cambridge University Press:
    15 February 2011, 379
    Print publication:
    1996

  • Four-point bending method offers significant advantages over more traditional techniques in measuring adhesion properties of thin polymer films. The former utilizes sandwich structure beams where the polymer film and the interface of interest are placed at the center of two elastic bulks. Such confined geometry closely resembles applications where polymer films are used as dielectric layers in IC interconnect technology. In this work, the bonding between a poly(arylene ether) (PAE) based polymer film and an Al film was studied. Ti layers of several different thickness were used as adhesion promoter. The sandwich samples were made by bonding bulk wafers using an epoxy. Fracture energies were seen to increase with the thickness of the Ti layer. Effects of heat treatment were also studied.