6 results
Silicon Interposer Reliability Optimization through Process-Oriented Stress Modeling
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1428 / 2012
- Published online by Cambridge University Press:
- 30 July 2012, mrss12-1428-c10-04
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- 2012
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Microbump Impact on Reliability and Performance in Through-Silicon Via Stacks
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1335 / 2011
- Published online by Cambridge University Press:
- 10 August 2011, mrss11-1335-o08-05
- Print publication:
- 2011
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Material, Process and Geometry Effects on Through-Silicon Via Reliability and Isolation
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1249 / 2010
- Published online by Cambridge University Press:
- 01 February 2011, 1249-F09-08
- Print publication:
- 2010
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Viscoelastic Modeling and Reliability Assessment of Microelectronics Packages
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1158 / 2009
- Published online by Cambridge University Press:
- 31 January 2011, 1158-F01-08
- Print publication:
- 2009
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Numerical Analysis of Packaging-Induced Failures in Cu/Low-k Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1079 / 2008
- Published online by Cambridge University Press:
- 01 February 2011, 1079-N09-09
- Print publication:
- 2008
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Impact of Fabrication Process, Layout Variation and Packaging Process on Cu/Low-k Interconnect Reliability
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- Journal:
- MRS Online Proceedings Library Archive / Volume 990 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 0990-B10-02
- Print publication:
- 2007
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