Picloram uptake, translocation, and efficacy were studied using greenhouse-grown Russian knapweed plants. Uptake of 14C-picloram, applied as discrete droplets to adaxial leaf surfaces of well-watered plants, averaged less than 10% of that applied. Most uptake occurred within 30 min of application. Uptake increased linearly with external picloram concentrations from 6.2 to 74.5 mM and was proportional to picloram concentration. Only about 10% of absorbed picloram was translocated out of the treated leaf of well-watered plants within 96 h, with approximately equal acropetal and basipetal translocation. Water stress before, at the time of, and after picloram application did not affect picloram uptake, but reduced total translocation and increased the relative amount translocated basipetally. Water stress also reduced picloram efficacy. Although Silwett L-77 increased picloram uptake into Russian knapweed leaves, it did not increase efficacy under water stress conditions.

The method by which the weight, volume, density and sinking factor of living aquatic organisms can be determined has been extended. By sinking factor is meant the ratio of the density of the organism to that of its environment at the time of the actual determination. The density of the environment is always raised to 1000, and the density of the organisms computed on this basis.

A quick and accurate method for determining the percentage of water in a living organism has been described and discussed.

On the assumption that a sponge consists of protoplasm and spicules only, the density of the protoplasm has been computed.

The sinking factor of several fish and of the embryos of some Crustacea at different stages has been determined. One effect of the swim-bladder in teleost fishes is to reduce the sinking factor and thus facilitate swimming.

The effect of the sinking factor on swimming in general and the effects of spinous outgrowths in pelagic Crustacea are discussed.

One of the lobsters kept in the tanks of the Plymouth Laboratory moulted on the night of 2 0 August 1940. This opportunity was taken to examine the changes in water content and osmotic pressure of the freshly moulted as compared with unmoulted lobsters. Though only one recently moulted individual has been examined, the results seem to be worthy of note since so far as we are aware no data are available on the subject in regard to Homarus. The biology of moulting among lobsters has received the attention of many investigators (vide Herrick (1895) and Drach (1939) for summary and literature).

The water content was determined by distilling the fresh lobster together with a known weight of sea water under xylol. This method is a modification of that of Dean and Stark which one of us (A. G. L.) has tried on a number of animals and found to give accurate results. The density was estimated by a modification of a method previously described (Lowndes, 1938). Osmotic pressure of blood and the external medium were measured by Baldes's (1934) modification of the Hill thermoelectric technique, as employed by one of us (N. K. P.) in the study of prawns and other crustaceans. The water content of the moulted skin was calculated from its dry weight taken after dehydrating in a hot air oven for 48 hr. at 105° C. Osmotic pressure was measured 17±6 hr. after moult; density and water content after 34±6hr. The temperature of sea water at which the density was estimated was 17° C.

During the War a considerable amount of work of a somewhat geological nature was done in the laboratories of Nobel's Explosives Co., chiefly in connexion with providing acid-resisting material for use in the sulphuric and nitric acid plants.

The size distributions of Si and ZnTe nanoparticles produced by low energy density ArF (193 nm) pulsed laser ablation into ambient gases were measured as a function of the gas pressure, P, and target-substrate separation, Dts. For both Si and ZnTe, the largest nanoparticles were found closest to the ablation target, and the mean nanoparticle size decreased with increasing Dts. For Si ablation into He, the mean nanoparticle diameter did not increase monotonically with gas pressure but reached a maximum near P = 6 Torr. High resolution Z-contrast transmission electron microscopy and energy loss spectroscopy revealed that ZnTe nanoparticles consist of a crystalline core surrounded by an amorphous ZnO shell; growth defects and surface steps are clearly visible in the crystalline core. A pronounced narrowing of the ZnTe nanocrystal size distribution with increasing Dts also was found. The results demonstrate that the size of laser-ablated nanoparticles can be controlled by varying the molecular weight and pressure of an ambient gas and that nanometer-scale particles can be synthesized. Larger aggregates of both ZnTe and Si having a “flakelike” or “weblike” structure were formed at the higher ambient gas pressures; for ZnTe these appear to be open agglomerates of much smaller (∼10 nm) particles.

The principal interests in this work are energetic-beam control of carbon-film properties and the roles of doping and surface morphology in field emission. Carbon films with variable sp3-bonding fraction were deposited on n-type Si substrates by ArF (193 nm) pulsed-laser ablation (PLA) of a pyrolytic graphite target, and by direct metal ion beam deposition (DMIBD) using a primary Cs+ beam to generate the secondary C- deposition beam. The PLA films are undoped while the DMIBD films are doped with Cs. The kinetic energy (KE) of the incident C atoms/ions was controlled and varied over the range from ∼25 eV to ∼175 eV. Earlier studies have shown that C films' sp3-bonding fraction and diamond-like properties can be maximized by using KE values near 90 eV. The films' surface morphology, sp3–bonding fraction, and Cs-content were determined as a function of KE using atomic force microscopy, TEM/EELS, Rutherford backscattering and nuclear reaction measurements, respectively. Field emission (FE) from these very smooth undoped and Cs-containing films is compared with the FE from two types of deliberately nanostructured carbon films, namely hot-filament chemical vapor deposition (HF-CVD) carbon and carbon nanotubes grown by plasma-enhanced CVD. Electron field emission (FE) characteristics were measured using ∼25-μm, ∼5-μm and ∼1-μm diameter probes that were scanned with ∼75 nm resolution in the x-, y-, and z-directions in a vacuum chamber (∼5 × 10-7 torr base pressure) equipped with a video camera for viewing. The hydrogen-free and very smooth a-D or a-C films (with high or low sp3 content, and with or without ∼1% Cs doping) produced by PLD and DMIBD are not good field emitters. Conditioning accompanied by arcing was required to obtain emission, so that their subsequent FE is characteristic of the arc-produced damage site. However, deliberate surface texturing can eliminate the need for conditioning, apparently by geometrical enhancement of the local electric field. But the most promising approach for producing macroscopically flat FE cathodes is to use materials that are highly nanostructured, either by the deposition process (e.g. HF-CVD carbon) or intrinsically (e.g. carbon nanotubes). HF-CVD films were found to combine a number of desirable properties for FE displays and vacuum microelectronics, including the absence of conditioning, low turn-on fields, high emission site density, and apparent stability and durability during limited long-term testing. Preliminary FE measurements revealed that vertically aligned carbon nanotubes are equally promising.

Spectroscopic ellipsometry is used to characterize amorphous diamond, also known as tetrahedral amorphous carbon, (ta-C) films grown by pulsed laser ablation. The ellipsometry data is collected with the two-modulator generalized ellipsometer, which measures all three parameters required to characterize isotropic samples, as well as additional parameters used to characterize strain-induced birefringence of the focusing optics. Lenses are used to focus the light spot to an ellipse 0.7 × 2.0 mm2, allowing us to perform several ellipsometric measurements across the profile of ta-C films grown on 7.5 cm diameter Si wafers. The spectroscopic ellipsometry data are fit using a model of the ta-C dielectric function based on the Tauc band edge and the Lorentz expression of the dielectric function for an ensemble of atoms. These fits are used to determine the thicknesses of the rough surface layer, the ta-C film, and the interface layer, as well as the energy gap of the film. Comparisons are made with fits to an earlier formulation due to Forouhi and Bloomer [Phys. Rev. B 34, 7018 (1986).]. In addition to being Kramers-Kronig consistent, the Tauc-Lorentz formulation fits the ta-C data better.

A systematic study has been made of changes in the bonding and optical properties of hydrogen-free tetrahedral amorphous carbon (ta-C) films, as a function of the kinetic energy of the incident carbon ions measured under film-deposition conditions. Ion probe measurements of the carbon ion kinetic energies produced by ArF and KrF laser ablation of graphite are compared under identical beam-focusing conditions. Much higher C+ kinetic energies are produced by ArF-laser ablation than by KrF for any given fluence and spot size. Electron energy loss spectroscopy and scanning ellipsometry measurements of the sp3 bonding fraction, plasmon energy, and optical properties reveal a well-defined optimum kinetic energy of 90 eV to deposit ta-C films having the largest sp3 fraction and the widest optical (Tauc) energy gap (equivalent to minimum near-gap optical absorption). Tapping-mode atomic force microscope measurements show that films deposited at near-optimum kinetic energy are extremely smooth, with rms roughness of only ~ 1 Å over distances of several hundred nm, and are relatively free of particulates.

Pulsed KrF (248nm) laser ablation of polycrystalline ZnS and ZnSe targets has been used to grow high quality, fully epitaxial ZnS and ZnSe thin films on (001) GaAs. Photoluminescence measurements of the ZnS thin films show strong edge emission, while ZnSe thin films show free excitonic as well as donor and acceptor peaks. By alternately ablating each target, strained layer superlattices of the form (ZnSe)m–(ZnS)n were grown with as many as 65 periods of compositional modulation. A ZnSxSe1–x structure also was fabricated which simultaneously incorporated both continuously graded and abrupt compositional changes.

Nanosecond time-resolved reflectivity and ellipsometry experiments have been performed on (100) Si wafers encapsulated by 5.5–76.2 nm thick thermal oxides, using pulsed KrF (248 nm) laser energy densities sufficient to melt the Si beneath the oxide. Post-irradiation nulling ellipsometry, optical microphotography, and surface profiling measurements were carried out. It was found that the threshold energy density required to melt the Si varies with oxide thickness; this is explained primarily by the reflective properties of the oxide overlayer. The time-resolved reflectivity and ellipsometry measurements show that rippling of the SiO2 layer occurs on the 20–40 ns timescale and results in a decrease in specular reflectivity of the rippled silicon surface beneath. Optical model calculations suggest that pulsed laser annealing through a thick oxide layer results in a damaged near-surface silicon layer (∼ 30 nm thick); this layer contains defects that are probably responsible for the degraded performance of devices.

Nanosecond resolution visible (633 nm) and near-infrared (1152 nm) reflectivity measurements have been used, together with transmission electronmicroscopy (TEM), to study pulsed KrF (248 nm) laser melting and subsequent solidification of thick (190–410 nm) amorphous (a) silicon layers. The measurements cover the entire laser energy density (El) range between the onset of melting (∼ 0.12 J/cm2) and the completion of epitaxial crystallization (∼1.1 J/cm2). Four distinct El-regimes of melting and solidification are found for the 410-nm thick a-Si layers. For El > 0.25 J/cm2, the time of formation, velocity and final depth of “explosively” propagating undercooled liquid layers were measured in specimens that had been uniformly implanted with Si, Ge, or Cu. TEM shows that the “fine-grained polycrystalline Si” produced by explosive crystallization (XC) actually contains large numbers of disk-shaped Si flakes that have largely amorphous centers and are visible only in plan view. The optical and TEM measurements suggest (1) that flakes are the crystallization events that initiate XC, and (2) that lateral heat flow (parallel to the sample surface) must be taken into account in order to understand flake formation. Results of new two-dimensional (2-D) model calculations of heat flow and solidification are presented. These calculations confirm the importance of 2-D heat flow and crystallite growth early in the solidification process. For 0.3 4 < El > 1.0 J/cm2, pronounced changes in both the shape and the duration of the reflectivity signals provide information about the growth of polycrystalline grains; this information can be correlated with post-irradiation plan and cross-section view TEM microstructural measurements.

Nanosecond resolution time-resolved visible (632.8 nm) and infrared (1152 nm) reflectivity measurements, together with structural and Z-contrast transmission electron microscope (TEM) imaging, have been used to study pulsed laser melting and subsequent solidification of thick (190–410 nm) amorphous (a) Si layers produced by ion implantation. Melting was initiated using a KrF (248 nm) excimer laser of relatively long [45 ns full width half maximum (FWHM)] pulse duration; the microstructural and time-resolved measurements cover the entire energy density (E1) range from the onset of melting (at ∼ 0.12J/cm2) up to the onset of epitaxial regrowth (at ∼ 1.1 J/cm2). At low E1 the infrared reflectivity measurements were used to determine the time of formation, the velocity, and the final depth of “explosively” propagating buried liquid layers in 410 nm thick a-Si specimens that had been uniformly implanted with Si, Ge, or Cu over their upper ∼ 300 nm. Measured velocities lie in the 8–14 m/s range, with generally higher velocities obtained for the Ge- and Cu-implanted “a-Si alloys.” The velocity measurements result in an upper limit of 17 (± 3) K on the undercooling versus velocity relationship for an undercooled solidfying liquid-crystalline Si interface. The Z-contrast scanning TEM measurements of the final buried layer depth were in excellent agreement with the optical measurements. The TEM study also shows that the “fine-grained polycrystalline Si” region produced by explosive crystallization of a-Si actually contains large numbers of disk-shaped Si flakes that can be seen only in plan view. These Si flakes have highly amorphous centers and laterally increasing crystallinity; they apparently grow primarily in the lateral direction. Flakes having this structure were found both at the surface, at low laser E1, and also deep beneath the surface, throughout the “fine-grained poly-Si” region formed by explosive crystallization, at higher E1. Our conclusion that this region is partially amorphous (the centers of flakes) differs from earlier results. The combined structural and optical measurements suggest that Si flakes nucleate at the undercooled liquid-amorphous interface and are the crystallization events that initiate explosive crystallization. Time-resolved reflectivity measurements reveal that the surface melt duration of the 410 nm thick a-Si specimens increases rapidly for 0.3E1 <0.6 J/cm2, but then remains nearly constant for E1 up to ∼ 1.0 J/cm2. For 0.3 < E1 < 0.6 J/cm2 the reflectivity exhibits a slowly decaying behavior as the near-surface pool of liquid Si fills up with growing large grains of Si. For higher E1, a flat-topped reflectivity signal is obtained and the microstructural and optical studies together show that the principal process occurring is increasingly deep melting followed by more uniform regrowth of large grains back to the surface. However, cross-section TEM shows that a thin layer of fine-grained poly-Si still is formed deep beneath the surface for E1<0.9 J/cm2, implying that explosive crystallization occurs (probably early in the laser pulse) even at these high E1 values. The onset of epitaxial regrowth at E1 = 1.1 J/cm2 is marked by a slight decrease in surface melt duration.

Time-resolved reflectivity measurements of silicon and germanium have been made during pulsed KrF excimer laser irradiation. The reflectivity was measured simultaneously at both 1152 and 632.8 nm wavelengths, and the energy density of each laser pulse was monitored. The melt duration and the time of the onset of melting were measured and compared with the results of melting model calculations. For energy densities just above the melting threshold, it was found that the melt duration was never less than 20 ns for Si and 25 ns for Ge, while the maximum reflectivity increased from the value of the hot solid to that of the liquid over a finite energy range. These results, along with a reinterpretation of earlier time-resolved ellipsometry measurements, indicate that, during the melt-in process, the near-surface region does not melt homogeneously, but rather consists of a mixture of solid and liquid phases. The reflectivity at the onset of melting and in the liquid phase have been measured at both 632.8 and 1152 nm, and are compared with the results found in the literature.

The behavior of pulsed laser-induced “explosively” propagating buried molten layers (BL) in ion implantation-amorphized silicon has been studied in a time- and spatially-resolved way, using nanosecond time-resolved reflectivity measurements, “Z-contrast” scanning transmission electron microscope (STEM) imaging of implanted Cu ions transported by the BL, and helium ion backscattering measurements. Infrared (1152 nm) reflectivity measurements allow the initial formation and subsequent motion of the BL to be followed continuously in time. The BL velocity is found to be a function of both its depth below the surface and of the incident KrF laser energy density (El); a maximum velocity of about 14 m/s is observed, implying an undercoolingvelocity relationship of about 14 K/(m/s). Z-contrast STEM measurements show that the final BL thickness is less than 15 nm. Time-resolved optical, TEM and ion backscattering measurements of the final BL depth, as a function of E1, are also found to be in excellent agreement with one another.

Recently available experimental data indicate that the solidification of undercooled molten silicon prepared by pulsed laser melting of amorphous silicon is a complex process. Time-resolved reflectivity and electrical conductivity measurements provide information about near-surface melting and suggest the presence of buried molten layers. Transmission electron micrographs show the formation of both fine- and large-grained polycrystalline regions if the melt front does not penetrate through the amorphous layer. We have carried out extensive calculations using a newly developed computer program based on an enthalpy formulation of the heat conduction problem. The program provides the framework for a consistent treatment of the simultaneous formation of multiple states and phase-front propagation by allowing material in each finite-difference cell to melt, undercool, nucleate, and solidify under prescribed conditions. Calculations indicate possibilities for a wide variety of solidification behavior. The new model and selected results of calculations are discussed here and comparisons with recent experimental data are made.

Several advances in time-resolved optical measurement techniques have been made, which allow a more detailed determination of the optical properties of silicon immediately before, during, and after pulsed laser irradiation. It is now possible to follow in detail the time-resolved reflectivity signal near the melting threshold; measurements indicate that melting occurs in a spatially inhomogeneous way. The use of time-resolved ellipsometry allowed us to accurately measure the optical properties of the high reflectivity (molten) phase, and of the hot, solid silicon before and after the laser pulse. We obtain n = 3.8, k = 5.2 (±10.1) at λ = 632.8 nm for the high reflectivity phase, in minor disagreement with the published values of Shvarev et al. for liquid silicon. Before and after the high reflectivity phase, the time-resolved ellipsometry measurements are entirely consistent with the known optical properties of crystalline silicon at temperatures up to its melting point.

Raman temperature measurements during pulsed laser annealing of Si by Compaan and co-workers are critically examined. It has been shown previously that the Stokes to anti-Stokes ratio depends critically upon the optical properties of silicon as a function of temperature. These dependences, coupled with the large spatial and temporal temperature gradients normally found immediately after the high reflectivity phase, result in large variations in the calculated temperature depending upon the probe laser pulse width and the pulse-to-pulse and spatial variations in the annealing pulse energy density.

A pulsed ultraviolet excimer laser (XeCl, 308 nm wavelength, 40 nsec FWHM pulse duration) has been successfully used for laser annealing of both boron- and arsenic-implanted silicon. TEM, SIMS, and sheet electrical measurements are used to characterize specimens. C-V and I-V measurements demonstrate that near-ideal p-n junctions are formed (diode perfection factor A = 1.2). Electrical activation of implanted ions by single laser pulses is essentially complete for energy densities Eℓ≥ 1.4 J/cm2 , far below the threshold for substantial surface damage ∽4.5 J/cm2. Melting model calculations are in good agreement with observed thresholds for dopant redistribution and for epitaxial regrowth. Changes in annealing behavior resulting from multiple (1,2,5) laser pulses are also reported. Finally, we demonstrate the use of scanned overlapping excimer laser pulses for fabrication of large area (2 cm2 ) solar cells with good performance characteristics. In contrast to pulsed ruby laser annealing, high open circuit voltages can be obtained without the use of substrate heating.