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Modeling and analysis of ultrasonic power transfer system with tightly coupled solid medium

Published online by Cambridge University Press:  28 November 2016

Ho Fai Leung  and
Aiguo Patrick Hu
Ho Fai Leung*
Affiliation:
Department of Electrical and Computer Engineering, The University of Auckland, Auckland, New Zealand
Aiguo Patrick Hu
Affiliation:
Department of Electrical and Computer Engineering, The University of Auckland, Auckland, New Zealand
*
Corresponding author: H. F. Leung Email: hleu027@aucklanduni.ac.nz
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Abstract

Ultrasonic Power Transfer (UPT) has been developed as an alternative solution for achieving wireless power transfer. This paper proposes a new model describing UPT systems with tightly coupled piezoelectric transducers firmly bound to solid media. The model is derived from the short-circuit admittance of the system measured from the primary transducer. The mechanical characteristics of the system are modeled with parallel LCR branches, which reveal the fundamental relationships between the power transfer characteristics of the tightly coupled UPT system and system parameters. The loading conditions for achieving the maximum power transfer are identified, and the operating frequencies corresponding to the peak power transfer points for variable loads are determined. A practical UPT system is built with two 28 kHz Langevin-type piezoelectric transducers connected to a 5 mm-thick aluminum plate, and the practical results have verified the accuracy of the proposed model.

Keywords

Ultrasonic power transferAcoustic energy transferTightly coupled
Type
Research Article
Information
Wireless Power Transfer , Volume 4 , Issue 1 , March 2017 , pp. 1 - 12
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Copyright
Copyright © Cambridge University Press 2016 

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References

[1] Covic, G.A.; Boys, J.T.: Inductive power transfer. Proc. IEEE, 101 (2013), 1276–1289.Google Scholar
[2] Hui, S.Y.R.; Zhong, W.; Lee, C.K.: A critical review of recent progress in mid-range wireless power transfer. IEEE Trans. Power Electron., 29 (2014), 4500–4511.Google Scholar
[3] Liu, C., Hu, A.P.; Budhia, M.: A generalized coupling model for capacitive power transfer systems, in IECON 2010–36th Annual Conf. IEEE Industrial Electronics Society, 2010, 274–279.Google Scholar
[4] Roes, M.G.L.; Duarte, J.L.; Hendrix, M.A.M.; Lomonova, E.A.: Acoustic energy transfer: a review. IEEE Trans. Ind. Electron., 60 (2013), 242–248.CrossRefGoogle Scholar
[5] Roes, M.G.L.; Hendrix, M.A.M.; Duarte, J.L.: Contactless energy transfer through air by means of ultrasound, in IECON 2011–37th Annual Conf. IEEE Industrial Electronics Society, 2011, 1238–1243.Google Scholar
[6] Bao, X. et al. : High-power piezoelectric acoustic-electric power feedthru for metal walls, in Proc. SPIE 6930, Industrial and Commercial Applications of Smart Structures Technologies, 2008, 69300Z–69300Z-8.CrossRefGoogle Scholar
[7] Ozeri, S.; Shmilovitz, D.: Simultaneous backward data transmission and power harvesting in an ultrasonic transcutaneous energy transfer link employing acoustically dependent electric impedance modulation. Ultrasonics, 54 (2014), 1929–37.Google Scholar
[8] Ozeri, S.; Shmilovitz, D.; Singer, S.; Wang, C.C.: Ultrasonic transcutaneous energy transfer using a continuous wave 650 kHz Gaussian shaded transmitter. Ultrasonics, 50 (2010), 666–674.Google Scholar
[9] Chakraborty, S.; Wilt, K.R.; Saulnier, G.J.; Scarton, H.A.; Das, P.K.: Estimating channel capacity and power transfer efficiency of a multi-layer acoustic-electric channel, in Proc. SPIE 8753, Wireless Sensing, Localization, and Processing VIII, 2013, 87530F–87530F-13.CrossRefGoogle Scholar
[10] Bao, X. et al. : Wireless piezoelectric acoustic-electric power feedthru, in Proc. SPIE 6529, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems, 2007, 652940–652940-7.Google Scholar
[11] Moss, S. et al. : Modelling and Experimental Validation of the Acoustic Electric Feedthrough Technique. Ft. Belvoir: Defense Technical Information Center, 2008.Google Scholar
[12] Yuantai, H.; Zhang, X.; Jiashi, Y.; Qing, J.: Transmitting electric energy through a metal wall by acoustic waves using piezoelectric transducers. IEEE Trans. Ultrason. Ferroelectr. Frequency Control, 50 (2003), 773–781.Google Scholar
[13] Charthad, J.; Weber, M.J.; Ting Chia, C.; Saadat, M.; Arbabian, A.: A mm-sized implantable device with ultrasonic energy transfer and RF data uplink for high-power applications, in 2014 IEEE Proc. Custom Integrated Circuits Conf. (CICC), 2014, 1–4.Google Scholar
[14] Lee, S.Q.; Youm, W.; Hwang, G.; Moon, K.S.; Ozturk, Y.: Resonant ultrasonic wireless power transmission for bio-implants, in Proc. SPIE 9057, Active and Passive Smart Structures and Integrated Systems, 2014, 90570J–90570J-9.Google Scholar
[15] Lawry, T.J.; Wilt, K.R.; Ashdown, J.D.; Scarton, H.A.; Saulnier, G.J.: A high-performance ultrasonic system for the simultaneous transmission of data and power through solid metal barriers. IEEE Trans. Ultrason. Ferroelectr. Frequency Control, 60 (2013), 194–203.Google Scholar
[16] Kinsler, L.E.; Frey, A.R.; Coppens, A.B.; Sanders, J.V.: Fundamentals of acoustics, 3rd ed., Wiley, New York, 1982.Google Scholar
[17] Lee, S.Q.; Youm, W.; Hwang, G.: Biocompatible wireless power transferring based on ultrasonic resonance devices, Proc. Meetings on Acoustics, Vol. 19, 2013, 030030.Google Scholar
[18] Ozeri, S.; Shmilovitz, D.: Ultrasonic transcutaneous energy transfer for powering implanted devices, 20100323 DCOM- 20100408.Google Scholar
[19] Leung, H.F.; Willis, B.J.; Hu, A.P.: Wireless electric power transfer based on Acoustic Energy through conductive media, in 2014 9th IEEE Conference on Industrial Electronics and Applications, 2014, 1555–1560.Google Scholar
[20] Moss, S. et al. : Design of the acoustic electric feedthrough demonstrator mk II. Annu. Rev. J. Inst. Mater. Eng. Australia LTD, 33 (2009), 187–200.Google Scholar
[21] Sherrit, S. et al. : 1 kW power transmission using Wireless Acoustic-Electric Feedthrough (WAEF), in Earth & Space, 2008, ed, 1–10.CrossRefGoogle Scholar
[22] Sherrit, S. et al. : Studies of acoustic-electric feed-throughs for power transmission through structures, in Proc. SPIE 6171, Smart Structures and Materials 2006: Industrial and Commercial Applications of Smart Structures Technologies, 2006, 617102–617102-8.Google Scholar
[23] Sherrit, S.; Badescu, M.; Bao, X.; Bar-Cohen, Y.; Chang, Z.: Efficient electromechanical network model for wireless acoustic-electric feed-throughs, in Proc. SPIE 5758, Smart Structures and Materials 2005: Smart Sensor Technology and Measurement Systems, 2005, 362–372.Google Scholar
[24] Lawry, T.J.; Wilt, K.R.; Scarton, H.A.; Saulnier, G.J.: Analytical modeling of a sandwiched plate piezoelectric transformer-based acoustic-electric transmission channel. IEEE Trans. Ultrason. Ferroelectr. Frequency Control, 59 (2012), 2476–2486.Google Scholar
[25] Harrie, A.C.T.: Equivalent circuit representation of electromechanical transducers: I. Lumped-parameter systems. J. Micromech. Microeng., 6 (1996), 157.Google Scholar
[26] David, J.; Cheeke, N.: Fundamentals and Applications of Ultrasonic Waves, 2nd ed., CRC Press, Boca Raton, 2002.Google Scholar
[27] Lide, D.R.: CRC Handbook of Chemistry and Physics, 85th ed., CRC Press, Cleveland, Ohio, 2004.Google Scholar
[28] Ultrasonic transducers [electronic resource]: materials and design for sensors, actuators and medical applications/guest editor Kentaro Nakamura, Woodhead Publishing Ltd, Cambridge, 2012.Google Scholar