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Flexible substrate technology for millimeter wave wireless power transmission

Published online by Cambridge University Press:  06 April 2016

Zhening Yang
Affiliation:
CNRS, LAAS, 7 Avenue du Colonel Roche, F-31400 Toulouse, France. Phone: +33 5 61 33 63 79 Univ de Toulouse, INSA, LAAS, F-31400 Toulouse, France
Alexandru Takacs
Affiliation:
CNRS, LAAS, 7 Avenue du Colonel Roche, F-31400 Toulouse, France. Phone: +33 5 61 33 63 79 Univ de Toulouse, UPS, LAAS, F-31400 Toulouse, France
Samuel Charlot
Affiliation:
CNRS, LAAS, 7 Avenue du Colonel Roche, F-31400 Toulouse, France. Phone: +33 5 61 33 63 79
Daniela Dragomirescu*
Affiliation:
CNRS, LAAS, 7 Avenue du Colonel Roche, F-31400 Toulouse, France. Phone: +33 5 61 33 63 79 Univ de Toulouse, INSA, LAAS, F-31400 Toulouse, France
*
Corresponding author:D. Dragomirescu Email: daniela.dragomirescu@laas.com

Abstract

In this paper, a technology based on thin flexible polyimide substrate (Kapton) to develop antennas for millimeter wave wireless power transmission is presented. Firstly, we characterize the Kapton polyimide (relative permittivity and loss tangent) using a ring resonator method up to V band. A 60 GHz patch antenna is designed, fabricated, and measured to validate our technology. Crossed-dipoles array antennas at Ku band and K band for energy harvesting are also designed, fabricated, and measured. Then a prototype of crossed-slot dipole antenna at V band is proposed. Finally, a resistivity characterization of Au bump used in flip-chip packaging is done, which leads us one step further toward aheterogeneous integration on flexible substrate of different components for Wireless Sensor Network nodes.

Type
Research Article
Copyright
Copyright © Cambridge University Press 2016 

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References

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