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Femtosecond laser machining and lamination for large-area flexible organic microfluidic chips

Published online by Cambridge University Press:  10 March 2009

C. Khan Malek
Affiliation:
Laboratoire FEMTO-ST/Dpt. MN2S, CNRS UMR 6174, 32 Av. de l'Observatoire, 25044 Besançon, France
L. Robert
Affiliation:
Laboratoire FEMTO-ST/Dpt. MN2S, CNRS UMR 6174, 32 Av. de l'Observatoire, 25044 Besançon, France
R. Salut
Affiliation:
Laboratoire FEMTO-ST/Dpt. MN2S, CNRS UMR 6174, 32 Av. de l'Observatoire, 25044 Besançon, France
Corresponding
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Abstract

A hybrid process compatible with reel-to-reel manufacturing is developed for ultra low-cost large-scale manufacture of disposable microfluidic chips. It combines ultra-short laser microstructuring and lamination technology. Microchannels in polyester foils were formed using focused, high-intensity femtosecond laser pulses. Lamination using a commercial SU8-epoxy resist layer was used to seal the microchannel layer and cover foil. This hybrid process also enables heterogeneous material structuration and integration.

Keywords

Type
Research Article
Copyright
© EDP Sciences, 2009

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References

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Femtosecond laser machining and lamination for large-area flexible organic microfluidic chips
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