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Conidial adhesion and germination of Pestalotiopsis neglecta

Published online by Cambridge University Press:  01 August 2000

K. WATANABE
Affiliation:
Faculty of Agriculture, Tamagawa University, Machida, Tokyo 194-8610, Japan
D. G. PARBERY
Affiliation:
Department of Crop Sciences, The University of Melbourne, Parkville, Victoria 3052, Australia
T. KOBAYASHI
Affiliation:
Department of International Agricultural Development, Tokyo University of Agriculture, Setagaya, Tokyo 156-8502, Japan
Y. DOI
Affiliation:
The University of Tokyo, Bunkyo, Tokyo 113-8657, Japan. E-mail: wkyoko@agr.tamagawa.ac.jp
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Abstract

The adhesion of conidia of Pestalotiopsis neglecta occurs in four stages in a specific manner which allows the first cell most likely to germinate to become firmly attached its substrate while leaving the other two fertile cells free to be dispersed further, thereby increasing the chance of further successful infections. The first stage of adhesion involves the mucilaginous coating acquired from the conidial matrix and appears weak. The second stage of adhesion is also relatively weak and occurs at the bases of the pedicel. The third stage occurs with the release of a fibrillar adhesive substance from along the length of the pedicel to the top of the basal cell and at times a lesser amount of fibrillar material is released from the apical appendages. The fourth stage involves the release of fibrillar material at the point of germtube emergence. The third and fourth stages provide strong attachment.

Type
Research Article
Copyright
© The British Mycological Society 2000

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