Symposium AA – Advanced Interconnects for Micro- and Nanoelectronics—Materials, Processes and Reliability
Articles
Evaluating Oxide Liner and Copper Barrier Integrity of Through-Silicon-Via by Electrical Characterization and Microanalysis
- Published online by Cambridge University Press: 05 June 2013, mrss13-1559-aa08-04
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A New Solution to the Ni-fill issue for Silicide-last Process
- Published online by Cambridge University Press: 18 July 2013, mrss13-1559-aa05-15
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Analysis of Cu-Line EM Failure Kinetics Using Mass Transport TCAD Simulations
- Published online by Cambridge University Press: 18 July 2013, mrss13-1559-aa05-07
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Self-learning kinetic Monte Carlo model for arbitrary surface orientations
- Published online by Cambridge University Press: 29 May 2013, mrss13-1559-aa07-03
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Sealing of low-k dielectric (k=2.0) with self-assembled monolayers (SAMs) for the atomic layer deposition (ALD) of TiN
- Published online by Cambridge University Press: 05 June 2013, mrss13-1559-aa05-22
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Electrophoretic Deposition of Carbon Nanotubes for Interconnections in Microelectronics
- Published online by Cambridge University Press: 05 June 2013, mrss13-1559-aa05-08
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Horizontal carbon nanotube interconnects for advanced integrated circuits.
- Published online by Cambridge University Press: 17 July 2013, mrss13-1559-aa02-01
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Package Reliability Analysis with Coupled Electro-Thermal and Mechanical Modeling
- Published online by Cambridge University Press: 31 May 2013, mrss13-1559-aa08-05
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Materials and scaling effects on on-chip interconnect reliability
- Published online by Cambridge University Press: 18 July 2013, mrss13-1559-aa07-01
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Effects of VUV and EUV Radiation on Ultra Low-k Materials Damage
- Published online by Cambridge University Press: 29 May 2013, mrss13-1559-aa03-11
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Adhesion Strength and Microstructure of Cu/Ni/OsOx/glass Structure for Highly-Reliable Cu Interconnection
- Published online by Cambridge University Press: 03 July 2013, mrss13-1559-aa08-03
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Performance and Reliability of Thick Cu Interconnects for RF and Analog/Mixed Signal Technology
- Published online by Cambridge University Press: 29 May 2013, mrss13-1559-aa08-08
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Structural Analysis of Pore Seal Layer Fabricated by Wet-process on Porous Low-k Films
- Published online by Cambridge University Press: 30 May 2013, mrss13-1559-aa06-04
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Silicon photonics transceivers with InP on Si lasers
- Published online by Cambridge University Press: 29 May 2013, mrss13-1559-aa02-05
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Post-etch treatment enabled electroless copper metallization of porous dielectric
- Published online by Cambridge University Press: 29 May 2013, mrss13-1559-aa04-01
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Understanding the Fundamentals for Package Induced Failure in BEOL Interconnect at 20nm Node
- Published online by Cambridge University Press: 29 May 2013, mrss13-1559-aa08-01
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SiC multilayer add/drop filter for optical interconnects
- Published online by Cambridge University Press: 29 May 2013, mrss13-1559-aa02-06
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Mechanisms overview of Thermocompression Process for Copper Metal Bonding
- Published online by Cambridge University Press: 05 June 2013, mrss13-1559-aa08-07
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