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Using Convective Flow Splitting for the Direct Printing of Fine Copper Lines

Published online by Cambridge University Press:  10 February 2011

T. Cuk ,
S.M. Troian ,
C.M. Hong  and
S. Wagner
T. Cuk
Affiliation:
ELE Department, Princeton University, Princeton, NJ 08544, tanjacuk@princeton.edu
S.M. Troian
Affiliation:
CHE Department, Princeton University, Princeton, NJ 08544
S. Wagner
Affiliation:
ELE Department, Princeton University, Princeton, NJ 08544
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Abstract

We have developed a technique for the printing of copper lines using solutions of a metal organic precursor, copper hexanoate. A 500-µm written liquid line is observed to split into two 100-µm wide lines. We observe further splitting into four parallel lines in experiments with written lines of copper hexanoate solution in chloroform. Surface profiles indicate that the thickness, width and number of lines formed are strongly dependent on the solution viscosity and volume per unit length deposited. From particle tracking visualization and surface profiling, we have found that evaporative cooling produces Marangoni convection patterns that accrete the solute along two key boundaries of flow

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 624: Symposium V – Materials Development for Direct Write Technologies , 2000 , 267
Copyright
Copyright © Materials Research Society 2000

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References

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