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Transmission Fourier Transform Infra-red Spectroscopy Investigation of Structure Property Relationships in Low-k SiOxCy:H Dielectric Thin Films

Published online by Cambridge University Press:  03 January 2013

Sean W. King
Affiliation:
Logic Technology Development, Intel Corporation, Hillsboro, OR 97124, U.S.A.
Ebony Mays
Affiliation:
Logic Technology Development, Intel Corporation, Hillsboro, OR 97124, U.S.A.
Canay Ege
Affiliation:
Logic Technology Development, Intel Corporation, Hillsboro, OR 97124, U.S.A.
Niklas Hellgren
Affiliation:
Logic Technology Development, Intel Corporation, Hillsboro, OR 97124, U.S.A.
Jessica Xu
Affiliation:
Logic Technology Development, Intel Corporation, Hillsboro, OR 97124, U.S.A.
Han Li
Affiliation:
Logic Technology Development, Intel Corporation, Hillsboro, OR 97124, U.S.A.
Boyan Boyanov
Affiliation:
Logic Technology Development, Intel Corporation, Hillsboro, OR 97124, U.S.A.
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Abstract

In order to understand the structure property relationships for inorganic low dielectric constant (i.e. low-k) materials, transmission Fourier Transform-Infrared (FTIR) spectroscopy has been utilized to study the local bonding structure in various plasma enhanced chemically vapor deposited low-k materials in the SiOxCy:H phase diagram. The FTIR measurements were combined with additional mechanical, electrical, and optical property measurements to elucidate the structure property relationships for these materials. The combined measurements show that increased incorporation of terminal methyl bonding results in a decrease in network bonding that manifests itself in a reduction in mass density, dielectric constant, refractive index, Young’s modulus and many other important material properties.

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Articles
Copyright
Copyright © Materials Research Society 2012

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