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Thermoelectric Modules For High Temperature Waste Heat

Published online by Cambridge University Press:  01 February 2011

Ryoji Funahashi
Affiliation:
funahashi-r@aist.go.jp, National Institute of Advanced Industrial Science & Technology, 1-8-31 Midorigaoka, Ikeda, Osaka, 563-8577, Japan
Toshiyuki Mihara
Affiliation:
t-mihara@aist.go.jp, Japan
Masashi Mikami
Affiliation:
m-mikami@aist.go.jp, Japan
Saori Urata
Affiliation:
urata-s@aist.go.jp, Japan
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Abstract

A new adhesive material has been developed in order to obtain practically usable thermoelectric modules composed of oxide thermoelectric legs. The thermoelectric module composed of 8-pair oxide legs has been fabricated. Both hot- and cold-sides of the module were covered by alumina plates. Open circuit voltage VO and maximum power Pmax reach 0.38 V and 0.30 W, respectively at 803 K of a hot-side temperature TH and 362 K of a temperature differential ΔT between TH and cold-side temperature TC. Generating power was repeated 11 times at 873-993 K of TH and at 200-290 K of ΔT. The module was cooled down to room temperature after each generation. At third measurement internal resistance RI of the module increased by 30 %. This is due to destruction of junctions because of thermal strain. No deterioration, however, was observed in thermoelectric properties for the oxide legs.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

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References

REFERENCES

1. Terasaki, I., Sasago, Y. and Uchinokura, K., Phys. Rev. B, 56, 12685 (1997).Google Scholar
2. Funahashi, R., Matsubara, I., Ikuta, H., Takeuchi, T., Mizutani, U. and Sodeoka, S., Jpn. J. Appl. Phys., 39, L1127 (2000).Google Scholar
3. Miyazaki, Y., Kudo, K., Akoshima, M., Ono, Y., Koike, Y. and Kajitani, T., Jpn. J. Appl. Phys., 39, L531 (2000).Google Scholar
4. Funahashi, R. and Matsubara, I., Appl. Phys. Lett., 79, 362 (2001).Google Scholar
5. Ohtaki, M., Koga, H., Tokunaga, T., Eguchi, K. and Arai, H., J. Solid State Chem., 120, 105 (1995).Google Scholar
6. Masuda, Y., Ohta, M., Seo, W.S., Pitschke, W. and Koumoto, K., J. Solid State Chem., 150, 221 (2000).Google Scholar
7. Shin, W. and Murayama, N., Jpn. J. Appl. Phys., 38, L1336 (1999).Google Scholar
8. Matsubara, I., Funahashi, R., Takeuchi, T., Sodeoka, S., Shimizu, T., and Ueno, K., Appl. Phys. Lett., 78, 3627 (2001).Google Scholar
9. Shin, W., Murayama, N., Ikeda, K., and Sano, S., J. Power Sources, 103, 80 (2001).Google Scholar
10. Funahashi, R., et al. , to be published.Google Scholar