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Texture and Resistivity of Cu and Dilute Cu Alloy Films

Published online by Cambridge University Press:  01 February 2011

K. Barmak ,
A. Gungor ,
A. D. Rollett ,
C. Cabral Jr  and
J. M. E. Harper
K. Barmak
Affiliation:
IBM T. J. Watson Research Center, P. O. Box 218, Yorktown Heights, NY 10598
A. Gungor
Affiliation:
IBM T. J. Watson Research Center, P. O. Box 218, Yorktown Heights, NY 10598
A. D. Rollett
Affiliation:
IBM T. J. Watson Research Center, P. O. Box 218, Yorktown Heights, NY 10598
C. Cabral Jr
Affiliation:
Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, PA 15213
J. M. E. Harper
Affiliation:
Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, PA 15213
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Abstract

Annealing of dilute binary Cu(Ti), Cu(In), Cu(Al), Cu(Sn), Cu(Mg), Cu(Nb), Cu(B), Cu(Co) and Cu(Ag) alloy films resulted in the strongest <111> fiber texture for Cu(Ti) and the lowest resistivity for Cu(Ag). The behavior of the alloy films was compared and contrasted with that for a pure evaporated Cu film. Electron beam evaporated films with compositions in the range of 2.0-4.2 at% and thicknesses in the range of 420-560 nm were annealed at 400°C for 5 hours. Two different approaches were used to derive volume fractions of texture components, namely fiber plots and orientation distributions. It is argued that for polytextured films such as the copper alloys studied here, orientation distributions derived from pole figures provide the most reliable basis for quantitative characterization.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 721: Symposia E/J – Texture and Microstructure in Electronic and Magnetic Films – Nanostructural Magnetic Materials for Data Storage , 2002 , J3.1
Copyright
Copyright © Materials Research Society 2002

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References

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