Hostname: page-component-8448b6f56d-m8qmq Total loading time: 0 Render date: 2024-04-19T00:30:58.516Z Has data issue: false hasContentIssue false
  • English
  • Français

Surface Modification of Silicon Nano Mechanical Structures by Carbon Ion Implantation for Post-fabrication Transformation to Silicon Carbide

Published online by Cambridge University Press:  26 February 2011

Kumar R Virwani ,
Dinesh K Sood ,
Robert G Elliman  and
Ajay P Malshe
Kumar R Virwani
Affiliation:
kvirwan@uark.edu, University of Arkansas, Department of Microelectronics Photonics, United States
Dinesh K Sood
Affiliation:
dsood@rmit.edu.au, Royal Melbourne Institute of Technology (RMIT), School of Electrical and Computer Engineering, Australia
Robert G Elliman
Affiliation:
Rob.Elliman@anu.edu.au, Australian National University, Department of Electronic Materials Engineering, Australia
Ajay P Malshe
Affiliation:
apm2@engr.uark.edu, University of Arkansas, Department of Mechancial Engineering, United States
Get access

Abstract

Internal stresses can cause de-lamination and fracture of coatings and structures and it is well known that ion-implantation can be used to control such behavior through modification of the stress. Here, however, we show that the unique ability of implantation to create controlled stresses in materials by altering both the chemical composition and mechanical properties, combined with an increase in the bending strength of materials, can used to create novel vertical nanostructures. Silicon cantilevers (beams), 193nm thick, 200nm wide and 3μm long, were implanted with carbon ions to create a buried SiCx layers. The internal stresses generated by implantation caused the beams to bend at angles ranging from 10 degrees to greater than 90 degrees, leading to unique vertical nanostructures. This method can be used to create 3-D nano electromechanical systems (NEMS).

Keywords

ion-beam processingnanostructurealloy
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 908: Symposium OO – Growth, Modification, and Analysis by Ion Beams at the Nanoscale , 2005 , 0908-OO16-03
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Williams, J. S., Rep. Prog. Phys. 49, 491 (1986).Google Scholar
2 Dearnaley, G., Rep. Prog. Phys. 32, 405 (1969).Google Scholar
3 Virwani, K. R., Malshe, A. P., Sood, D. K. and Elliman, R. G., Appl. Phys. Lett. 84, 3148 (2004).Google Scholar
4 Skorupa, W. and Yankov, R. A., Materials Chemistry and Physics 44, 101 (1996).Google Scholar
5 Lindner, J. K. N., Appl. Phys. A 77, 27–38 (2003).Google Scholar
6 Shackelford, J. F. and Alexander, W., CRC Materials Science and Engineering Handbook, (Taylor and Francis) (2000).Google Scholar
7 Ashurst, W. R., Yau, C., Carraro, C., Lee, C., Kluth, G. J., R. T. Howe and Maboudian, R., Sensors and Actuators A 91, 239 (2001).Google Scholar
8 Chu, W. K., Mayer, J. W., and Nicolet, M.A., Backscattering Spectrometry, Academic Press, (1978).Google Scholar
9 Namazu, T., Isono, Y., and Tanaka, T., J. Microelectromech. Syst. 9, 450 (2000).Google Scholar