Hostname: page-component-848d4c4894-sjtt6 Total loading time: 0 Render date: 2024-06-20T06:27:36.322Z Has data issue: false hasContentIssue false

Superconducting YBaCuO thin Films by Cu-Ion Implantation

Published online by Cambridge University Press:  26 February 2011

Kevin M. Hubbard
Affiliation:
Los Alamos National Laboratory, Los Alamos, NM 87545
Nicole Bordes
Affiliation:
Los Alamos National Laboratory, Los Alamos, NM 87545
Michael Nastasi
Affiliation:
Los Alamos National Laboratory, Los Alamos, NM 87545
Joseph R. Tesmer
Affiliation:
Los Alamos National Laboratory, Los Alamos, NM 87545
Get access

Abstract

We have investigated the fabrication of thin-film superconductors by Cu-ion implantation into initially Cu-deficient Y(BaF2)Cu thin films. The precursor films were co-evaporated on SrTiO3 substrates, and subsequently implanted to various doses with 400 keV 63Cu2+. Implantations were preformed at both LN2 temperature and at 380°C. The films were post-annealed in oxygen, and characterized as a function of dose by four-point probe analysis, X-ray diffraction, ion-beam backscattering and channeling, and scanning electron microscopy. It was found that a significant improvement in film quality could be achieved by heating the films to 380°C during the implantation. The best films became fully superconducting at 60–70 K, and exhibited good metallic R vs. T. behavior in the normal state.

Type
Research Article
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Koch, R.H., Umbach, CP., Clark, G.J., Chaudhari, P., and Laibowitz, R.B., Appl. Phys. Lett. 51, 200 (1987).Google Scholar
[2] Short, K.T. et al., Bull. Am. Phys. Soc. 33, 779 (1988).Google Scholar
[3] Nastasi, M., Tesmer, J.R., Hollander, M.G., Smith, J.F., and Maggiore, C.J., Appl. Phys. Lett. 52, 1729 (1988).Google Scholar
[4] Yang, K.Y., Homma, H., Lee, R., Bhadra, R., Grimsditch, M., Bader, S.D., Locquet, J.P., Bruynseraede, Y., and Schuller, I.K., Appl. Phys. Lett. 53, 808 (1988).Google Scholar
[5] TRIM89, see Zeigler, J.F., Biersack, J.P., and Littmark, U., The Stopping and Range of Ions in Solids, (Pergamon Press, New York, 1985).Google Scholar
[6] White, C.W., Boatner, L.A., Sklad, P.S., McHargue, C.J., Rankin, J., Farlow, G.C., and Aziz, M.J., Nucl. Instr. Meth. B32, 11 (1988).Google Scholar
[7] Bordet, P., Chaillout, C., Chenavas, J., Hodeau, J.L., Marezio, M., Karpinski, J., and Kaldis, E., Nature 334, 596 (1988).Google Scholar
[8] Sigmund, P., in Sputtering by Particle Bombardment 1, ed. Behrisch, R. (Springer-Verlag, New York, 1981) p.9.Google Scholar
[9] Kittel, C., Introduction to Solid State Physics, (John Wiley and Sons, New York, 1976).Google Scholar
[10] Miedema, A.R., Z. Metallkde. 69, 287 (1978).Google Scholar
[11] Li, R.S. and Koshikawa, T., Surf. Sci. 151, 459 (1985).Google Scholar
[12] Hamilton, J.C., Phys. Rev. Lett. 42, 989 (1979).Google Scholar
[13] Bordes, N., Cohen, M., Nastasi, M., Rollett, A.D. and Maggiore, C.J., Thin Solid Films 181, 191 (1989).Google Scholar
[14] Koinuma, H., Fukuda, K., Hashimoto, T., and Fueki, K., Jap. J. Appl. Phys. 27, L1216 (1988).Google Scholar