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A Study of Trap Profiles in Thin Silicon Dioxide Films at Dielectric Breakdown Using Percolation Model

Published online by Cambridge University Press:  10 February 2011

S. Uno
Affiliation:
Department of Electronics and Information Systems, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan, uno@eie.eng.osaka-u.ac.jp
A. Ishida
Affiliation:
Department of Electronics and Information Systems, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan, uno@eie.eng.osaka-u.ac.jp
K. Okada
Affiliation:
Department of Electronics and Information Systems, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan, uno@eie.eng.osaka-u.ac.jp
T. Sakura
Affiliation:
Department of Electronics and Information Systems, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan, uno@eie.eng.osaka-u.ac.jp
K. Deguchi
Affiliation:
Department of Electronics and Information Systems, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan, uno@eie.eng.osaka-u.ac.jp
Y. Kamakura
Affiliation:
Department of Electronics and Information Systems, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan, uno@eie.eng.osaka-u.ac.jp
K. Taniguchi
Affiliation:
Department of Electronics and Information Systems, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan, uno@eie.eng.osaka-u.ac.jp
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Abstract

A Monte Carlo simulation of wear-out process in thin silicon dioxide films is performed to investigate the correlation between the electron trap distribution and the dielectric breakdown. Non-uniformity of the trap generation and its dependence on the stress conditions are monitored by the measurements of the charge centroid. In order to include these experimental observations into Degraeve's percolation model [IEDM Tech. Dig., pp.863-866 (1995)], we introduce exponential trap profiles decaying from the Si/SiO2 interface. Our new model successfully reproduces critical threshold voltage shifts from the information about critical charge centroids for various stress conditions. Finally, as a reasonable explanation of the stress dependent breakdown properties, we suggest that the bond strain caused by lattice mismatch at the interface is accelerated by the electric field.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

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