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Structural Investigations of Laser-Crystallized Hydrogenated Amorphous Silicon

Published online by Cambridge University Press:  10 February 2011

D. Toet
Affiliation:
Lawrence Livermore National Laboratory, 7000 East Ave., L-271, Livermore CA 94550 e-mail:toet1@llnl.gov
P.M. Smith
Affiliation:
Lawrence Livermore National Laboratory, 7000 East Ave., L-271, Livermore CA 94550
T.W. Sigmon
Affiliation:
Lawrence Livermore National Laboratory, 7000 East Ave., L-271, Livermore CA 94550
R. Qiu
Affiliation:
Applied Komatsu Technology, 3101 Scott Blvd., M/S 9155, Santa Clara, CA 95054
T. Takehara
Affiliation:
Applied Komatsu Technology, 3101 Scott Blvd., M/S 9155, Santa Clara, CA 95054
S. Sun
Affiliation:
Applied Komatsu Technology, 3101 Scott Blvd., M/S 9155, Santa Clara, CA 95054
C.C. Tsai
Affiliation:
Applied Komatsu Technology, 3101 Scott Blvd., M/S 9155, Santa Clara, CA 95054
W.R. Harshbarger
Affiliation:
Applied Komatsu Technology, 3101 Scott Blvd., M/S 9155, Santa Clara, CA 95054
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Abstract

We investigated the structure of hydrogenated amorphous silicon, thin films crystallized by short pulses from a XeCl excimer laser at fluences for which total melting of the films occurs. Atomic force microscopy revealed that films prepared using optimized process conditions, leading to hydrogen contents ≤ 5 at.%, are smoother after laser crystallization than those prepared by laser-dehydrogenation. The roughness of the laser-crystallized films increases with their thickness, and can be reduced by multiple exposure. A better smoothing is obtained by partially remelting the films after the first irradiation. Transmission electron microscopy shows that the grains in the laser-crystallized films have sizes that are comparable to the film thickness.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

[1] For a review, see Im, J. S. and Sposili, R. S., MRS Bulletin 21, 38 (1996).Google Scholar
[2] Sameshima, T., Usui, S., and Sekiya, M., IEEE Electron Device Lett. 7, 176 (1986).Google Scholar
[3] Brotherton, S. D., McCulloch, D. J., Clegg, J. B., and Gowers, J. P., IEEE Trans. Electron Devices 40, 407 (1993).Google Scholar
[4] Im, J. S., Kim, H. J., and Thompson, M. O., Appl. Phys. Lett. 63, 1969 (1993).Google Scholar
[5] Voutsas, T. and Hatalis, M., J. Appl. Phys. 76, 777 (1994).Google Scholar
[6] Miyata, Y., Furuta, M., Yoshioka, T., and Kawamura, T., J. Appl. Phys. 73, 3271 (1994).Google Scholar
[7] Mei, P., Boyce, J. B., Hack, M., Lujan, R. A., Johnson, R. I., Anderson, G. B., Ready, S. E., and Fork, D. K., J. Appl. Phys. 64, 1132 (1994).Google Scholar
[8] Fork, D. K., Anderson, G. B., Boyce, J. B., Johnson, R. I., and Mei, P., Appl. Phys. Lett. 68, 2139 (1996).Google Scholar
[9] Kuriyama, H., Nohda, T., Aya, Y., Kuwahara, T., Wakisaka, K., Kiyama, S., and Tsuda, S., Jpn. J. Appl. Phys. 33, 5657 (1994).Google Scholar
[10] Thompson, M. O., Galvin, G. J., Mayer, J. W., Peercy, P. S., Poate, J. M., Jacobson, D. C., Cullis, A. G., and Chew, N. G., Phys. Rev. Lett. 52, 2360 (1994).Google Scholar
[11] Stiffler, S. R. and Thompson, M. O., Phys. Rev. Lett. 60, 2519 (1988).Google Scholar