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The Role of Thermal Radiative Properties of Semiconductor Wafers in Rapid Thermal Processing

Published online by Cambridge University Press:  10 February 2011

P. J. Timans
P. J. Timans*
Affiliation:
AG Associates, 4425 Fortran Drive, San Jose, CA 95134-2300.
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Abstract

Rapid thermal processing (RTP) has become a key technology in the fabrication of advanced semiconductor devices. As RTP becomes the accepted technique for an increasingly wide range of processes in device fabrication, the understanding of the basic physics of radiation heat transfer in RTP systems is also being extended rapidly. This paper illustrates the use of optical models for prediction of the thermal radiative properties of semiconductor wafers. Such calculations can be used to address many of the key issues of interest in RTP, including questions concerning temperature measurement and process repeatability.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 429: Symposium N – Rapid Thermal and Integrated Processing V , 1996 , 3
Copyright
Copyright © Materials Research Society 1996

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