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Real Time Observation of Material Deformation Processes by Synchrotron White Beam X-ray Topography

Published online by Cambridge University Press:  10 February 2011

Z. B. Zhao
Affiliation:
Department of Materials Science & Engineering, University of Michigan, Ann Arbor, MI 48109-2136.
J. Hershberger
Affiliation:
Department of Materials Science & Engineering, University of Michigan, Ann Arbor, MI 48109-2136.
Z. U. Rek
Affiliation:
Stanford Synchrotron Radiation Laboratory, Stanford University, CA 94309
J. C. Bilello
Affiliation:
Department of Materials Science & Engineering, University of Michigan, Ann Arbor, MI 48109-2136.
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Abstract

An experimental apparatus which exploits synchrotron white beam X-ray diffraction topography has been developed to perform real time in situ observation of deformation processes of single crystals. The apparatus consists of a fully automated and remotely controlled mini-tensile device and a CCD based X-ray imaging detector with associated video system. Both tensile data and X-ray topographic images are recorded simultaneously. The materials under study include single crystals of Si, and single crystals or bicrystals of the refractory metals W and Mo. The deformation processes of these crystals have been studied by monitoring a selected transmission Laue spot while the specimen is mechanically cycled by loading and unloading. The X-ray images have been captured by a frame grabber and recorded via a VCR. Several phenomena have been observed, including bending contours, strain concentrations, reversible anelastic effect and microyielding. The observed stress relaxations are correlated to microstructural variations shown by X-ray topography. The stability of low angle grain boundaries in bicrystals; and the effect of high strength and toughness coatings on the deformation of single crystal substrates was investigated.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

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