Hostname: page-component-78c5997874-s2hrs Total loading time: 0 Render date: 2024-11-17T14:36:04.925Z Has data issue: false hasContentIssue false
  • English
  • Français

Preparation of Y-BA-CU Oxide Superconducting Composite Tapes by a Diffusion Process

Published online by Cambridge University Press:  28 February 2011

K. Tachikawa ,
M. Sugimoto ,
N. Sadakata  and
O. Kohno
K. Tachikawa
Affiliation:
Dept. of Materials Science, Tokai University, 1117 Kita-Kaname, Hiratsuka, Kanagawa 259–12, Japan
M. Sugimoto
Affiliation:
Fujikura Ltd., 1–5–1, Kiba, Koto-ku, Tokyo 135, Japan.
N. Sadakata
Affiliation:
Fujikura Ltd., 1–5–1, Kiba, Koto-ku, Tokyo 135, Japan.
O. Kohno
Affiliation:
Fujikura Ltd., 1–5–1, Kiba, Koto-ku, Tokyo 135, Japan.
Get access

Extract

Since discovery of the Y-Ba-Cu oxide compound showing superconductivity above liquid nitrogen temperature, intensive study has been under way to clarify nature of the high Tc oxides[l-4]. Much efforts were also made in the field of superconductor applications. A number of studies have been carried out by a powder metallurgical process of Y-Ba-Cu oxide compound wires, although, obtained critical current densities were still low at liquid nitrogen temperature[5–6]. Other techniques for wire fabrication is also being attempted[7–9]. In this study, Y-Ba-Cu oxide superconducting composite tapes were prepared by a diffusion process, which is one of the promising methods to obtain a high critical current density.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 99: Symposium AA – High-Temperature Superconductors , 1987 , 727
Copyright
Copyright © Materials Research Society 1988

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Wu, M. K., Ashburn, J. R., Torng, C. J., Hor, P. H., Meng, R. L., Gao, L., Haung, Z. J., Wang, Y. Q. and Chu, C. W.: Phys. Rev. Lett., 58(1987) 908.Google Scholar
2. Hi kami, S., Kagoshima, S., Komiyama, S., Hirai, T., Minami, H. and Masumi, T. : Jpn. J. Appl. Phys., 26(1987)L347.Google Scholar
3. Moodenbaugh, A. R., Suenaga, M., Asano, T., Shelton, R. N., Ku, H. C., McCallum, R. W. and Klavins, P.: Phys. Rev. Lett., 58(1987) 1885.Google Scholar
4. Murphy, D. W., Sunshine, S., van Dover, R. B., Cava, R. J., Batlogg, B., Zahurak, S. M. and Schneermeyer, L. F.: Phys. Rev. Lett., 58(1987) 1888.Google Scholar
5. Kohno, O., Ikeno, Y., Sadakata, N., Aoki, S., Sugi moto, M. and Nakagawa, M.: Jpn. J. Appl. Phys., 26(1987) 1653.Google Scholar
6. Yamada, Y., Fukushima, N., Nakayama, S., Yoshino, H. and Murase, S.: Jpn. J. Appl. Phys. 26(1987)L865.Google Scholar
7. Yurek, G. J., Varder Sande, J. B., Wang, W. X. and Ruman, D. A.: Submitted to Metall. Trans. A.Google Scholar
8. Yurek, G. J., Varder Sande, J. B., Wang, W. X. and Ruman, D. A.: Submitted to J. Electrochem. Soc.Google Scholar
9. Kumakura, H., Yoshida, Y. and Togano, K. : Jpn. J. Appl. Phys. 26(1987) L1172.Google Scholar