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Organic Die Coat Materials for Plastic Packages

Published online by Cambridge University Press:  21 February 2011

R. Padmanabhan
R. Padmanabhan*
Affiliation:
Physical Electronics & Packaging Laboratory, Final Manufacturing Research & Development, Motorola, Inc., Mail Drop B-136, 5005 East McDowell Road, Phoenix, Az. 85008
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Abstract

The role of organic materials in electronic packages is constantly being expanded. A fairly recent application is the use of these materials for encapsulating high lead count IC dice, like TAB chips that are bonded directly to the board or housed in plastic packages. Since these packages are non-hermetic, some special constraints are placed in the selection of these die coat materials. Reliability issues that have to be addressed include compatibility with the underlying dielectric medium, chemical resistance, low moisture absorption, corrosion protection and resistance to thermal stresses. This paper discusses some of these concerns and reviews the suitability of different categories of die coat materials for this application.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 99
Copyright
Copyright © Materials Research Society 1990

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References

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