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A Novel Technique for the Fabrication of Free-Standing Adhesive Films Using a Polymer Template

Published online by Cambridge University Press:  10 February 2011

D. J. Hansford ,
L. P. Lee  and
M. Ferrari
D. J. Hansford
Affiliation:
Biomedical Microdevices Center, 440 Evans Hall, University of California, Berkeley, CA 94720 Department of Materials Science and Mineral Engineering, U.C. Berkeley, CA 94720
L. P. Lee
Affiliation:
Biomedical Microdevices Center, 440 Evans Hall, University of California, Berkeley, CA 94720 Applied Science and Technology Program, U.C. Berkeley, CA 94720
M. Ferrari
Affiliation:
Biomedical Microdevices Center, 440 Evans Hall, University of California, Berkeley, CA 94720 Department of Materials Science and Mineral Engineering, U.C. Berkeley, CA 94720 Department of Civil and Environmental Engineering, U.C. Berkeley, CA 94720
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Abstract

A technique has been developed that allows the application of free-standing membranes of polymer adhesives used in microfabricated structures. The film is made free-standing by the application of the adhesive to a polymer template, followed by an adhesion step to a microfabricated substrate, and the final release of the film by the removal of the polymer template. It was found that the surface treatment used to treat the Teflon template made it adhere too strongly to the adhesive film for this application. The results show that Gel-Paks make a suitable template for the transference of polymer films over holes of at least micron size.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 518: Symposium N – Microelectromechanical Structures for Materials Research , 1998 , 111
Copyright
Copyright © Materials Research Society 1998

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References

1 Small, M.K. and Nix, W.D.. “Analysis of the accuracy of the bulge test in determining the mechanical properties of thin films.” Jo. Mater. Res. V. 7 (6). pp. 1553–63. 1992.Google Scholar
2 Williams, K.R. and Muller, R.S.. “Etching for Micromachining Processing.” UCB/ERL Mem. No. M96/37. University of California, Berkeley. 1996.Google Scholar
3 Small, M.K. et al. ”The elastic biaxial modulus of Ag-Pd multilayered thin films measured using the bulge test.” Jo. Mater. Res. V. 9 (1). pp. 25–30. 1994.Google Scholar
4 Fernando, M. et al. ”The use of the “inverted-blister” test to measure the adhesion of an electrocoated pain layer adhering to a steel substrate.” Jo. Mater. Sci. Let. V. 12. pp. 875–7. 1993.Google Scholar
5 Eaton, W.P., Risbud, S.H., and Smith, R.L.. “Silicon wafer-to-wafer bonding at T<200 °C with polymethylmethacrylate.” Appl. Phys. Let. V. 65 (4). 439–41. 1994.Google Scholar
6 Spierings, G.A.C.M. and Haisma, J.. “Direct bonding of organic materials.” Appl. Phys. Let. V. 64 (24). pp. 3246–8. 1994.Google Scholar
7 Hansford, D.. “Biocompatible Silicon Wafer Bonding for Biomedical Microdevices.” Master's Thesis. University of California, Berkeley. 1996.Google Scholar
8 Hansford, D. et al. ”Biocompatible Silicon Wafer Bonding for Biomedical Microdevices.” SPIE BIOS '98 Conference. Micro Nanofab. Struct. Dev. for Biomed. Envir. Appl'ns H, Jan. 1998.Google Scholar
9Product literature from Gel-Pak, Sunnyvale, CAGoogle Scholar