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Non-Destructive Evaluation of Strains and Voiding in Passivated copper Metallizations

Published online by Cambridge University Press:  21 February 2011

Richard P. Vinci ,
Thomas N. Marieb  and
John C. Bravman
Richard P. Vinci
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
Thomas N. Marieb
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
John C. Bravman
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
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Abstract

Stress induced voiding in passivated Cu lines was investigated by x-ray strain analysis and in-situ high voltage scanning electron microscope (HVSEM) techniques. Cu lines on a Ta underlayer and Cu lines on an Al underlayer were patterned by a trilayer liftoff technique and passivated with Si3N4. For direct observation of stress voiding, specimens were heated to 350°C in the HVSEM and then cooled and held at 150°C. Identical samples were subjected to the same thermal cycle for strain state determination using x-ray techniques. The hydrostatic stress state at each temperature was calculated from the measured strains. Few initial voids were observed after passivation in either sample. After heating to 350°C and cooling to the dwell temperature, no new voiding was seen in the Ta/Cu lines. Measured hydrostatic strains were half those measured in the Al/Cu lines. Heavy voiding was observed in the Al/Cu lines after cooling to the dwell temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 309: Symposium M2 – Materials Reliability in Microelectronics III , 1993 , 229
Copyright
Copyright © Materials Research Society 1993

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