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Modeling and Fabrication of Cladded Ge Quantum Dot Gate Silicon MOSFETs Exhibiting 3-State Behavior

Published online by Cambridge University Press:  01 February 2011

Faquir C. Jain
Affiliation:
fcj@engr.uconn.edu, University of Connecticut, ECE, Storrs, Connecticut, United States
Mukesh Gogna
Affiliation:
mukesh.gogna@engr.uconn.edu, University of Connecticut, Storrs, United States
Fuad Alamoody
Affiliation:
abuchi_fuad@hotmail.com, University of Connecticut, Storrs, United States
Supriya Karmakar
Affiliation:
suk06001@engr.uconn.edu, University of Connecticut, Storrs, United States
Ernesto Suarez
Affiliation:
ernesto.suarez@uconn.edu, University of Connecticut, Storrs, United States
John Chandy
Affiliation:
chandy@engr.uconn.edu, University of Connecticut, Storrs, United States
Evan Heller
Affiliation:
Evan@rsoftinc.com, RSoft Design Group, Ossinings, New York, United States
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Abstract

This paper presents electrical transfer (Id-Vg) and output (Id-Vds) characteristics of a GeOx-cladded-Ge quantum dot (QD) gate Si MOSFET devices. In QD gate FETs, the manifestation of an intermediate state ‘i” makes it a 3-state device. The intermediate state originates due to compensation of increment in the gate voltage by a similar increase in the threshold voltage, which occurs via charge neutralization in the QD gate due to transfer of charge from the inversion layer to either first or second of the two QD layers.

Type
Research Article
Copyright
Copyright © Materials Research Society 2009

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References

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