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Microthermomechanical Analysis of Lead-Free SN-3.9AG-0.6CU Alloys; Part I : Viscoplastic Constitutive Properties

Published online by Cambridge University Press:  21 March 2011

Peter Haswell  and
Abhijit Dasgupta
Peter Haswell
Affiliation:
CALCE Electronic Products and Systems Center University of Maryland, College Park, MD 20742, USA
Abhijit Dasgupta
Affiliation:
CALCE Electronic Products and Systems Center University of Maryland, College Park, MD 20742, USA
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Abstract

This is part I of a two-part paper on the mechanical behavior of lead-free solders. The constitutive properties of Sn3.9Ag0.6Cu lead-free alloy are presented and compared against baseline data from eutectic Sn63Pb37 solder. Monotonic, displacement-controlled and load-controlled tests are performed over various temperatures, strain rates and stresses using the thermo-mechanical-microstructural (TMM) test system. It is shown that the lead-free alloy exhibits creep strain rates that are from one to five orders of magnitude lower than the eutectic SnPb alloy, depending on the stress level and the homologous temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 682: Symposium N – Microelectronics and Microsystems Packaging , 2001 , N2.1
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

Bartelo, J., Cain, S.R., Caletka, D., Darbha, K., Gosselin, T., Henderson, D.W., King, D., Knadle, K., Sarkhel, A., Thiel, G., Woychik, C., Shih, D.Y., Kang, S., Puttlitz, K., Woods, J., “Thermomechanical Fatigue Behavior of Selected Lead-Free Solders,” IPC SMEMA Council APEX™ 20001.Google Scholar
Cutiongco, E. C., Vaynman, S., Fine, M. E., Jeannotte, D.A., 1990, “Isothermal Fatigue of 63Sn-37Pb Solder,” ASME Trans., Journal of Electronic Packaging, Vol. 112, No. 2, pp. 110–114.Google Scholar
Darveaux, R., 1997, “Solder Joint Fatigue Life Model,” in Design and Reliability of Solders and Solder Interconnections, The Minerals, Metals and Materials Society, pp. 213–218.Google Scholar
Dasgupta, A., Oyan, C., Barker, D., and Pecht, M., 1991, “Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach,” ASME Journal of Electronic Packaging, Vol. 114, No. 2, pp. 152–160.Google Scholar
Enke, N.F., Kilinski, T.J., Schroeder, S.A., Lesniak, J.R., 1989, “Mechanical Behaviors of 60/40 Tin-lead Solder Lap Joints,” IEEE Trans. CHMT, Vol. 12, No. 4, pp.459–468.Google Scholar
Guo, Z., Conrad, H., 1993, “Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints,” ASME Trans. J. Electronic Packaging, Vol. 115, No. 2, pp. 159–164.Google Scholar
Haswell, P., 2001, Durability Assesment and Microstructural Observations of Selected Solder Alloys, Ph.D. Dissertation, University of Maryland, College Park, MD.Google Scholar
Haswell, P., Dasgupta, A., 2000, “Durability Properties Characterization of Sn62Pb36Ag2 Solder Alloy,” 2000 ASME International Mechanical Engineering Congress and Exposition, Orlando, Florida.Google Scholar
Haswell, P., Dasgupta, A., 1999, “Viscoplastic Characterization of Constitutive Behavior of Two Solder Alloys,” 1999 ASME International Mechanical Engineering Congress and Exposition, November 14-19, 1999, Nashville, Tennessee.Google Scholar
Ju, S. H., Sandor, B. I., Plesha, M. E., Dec. 1996, “Life Prediction of Solder Joints by Damage and Fracture Mechanics,” ASME Trans., Journal of Electronic Packaging, Vol. 118, pp. 193–200.Google Scholar
National Electronics Manufacturing Initiative (NEMI), 2001, Lead Free Interconnects Project, www.nemi.org.Google Scholar
Mawer, A., Levis, K.-M., 2000, “Automotive PBGA Assembly and Board-Level Reliability with Lead-Free Versus Lead-Tin Interconnects,” SMTA 2000 (Sept. 24-28, 2000), Illinois.Google Scholar
Prasad, S., Carson, F., R., , Kim, G.S., Lee, J.S., Roubaud, P., Henshall, G., Kamath, S., Garcia, A., Herber, R., Bulwith, R., “Board Level Reliability of Lead-Free Packages”, SMTA 2000 (Sept. 24-28, 2000), Illinois.Google Scholar
Shine, M.C., Fox, L.R., 1988, “Fatigue of Solder Joints in Surface Mount Devices,” Low Cycle Fatigue, Solomon, , Halford, , Kaisand, , Leis, eds., ASTM STP 942.Google Scholar
Solomon, H.D., 1989, “Strain-Life Behavior in 60/40 Solder,” ASME Trans. J. Electronic Packaging, Vol. 111, No. 1, pp. 75–82.Google Scholar
Solomon, H.D., Tolksdorf, E.D., 1995, “Energy Approach to the Fatigue of 60/40 Solder: Part I–Influence of Temperature and Cycle Frequency,” ASME Trans. J. Electronic Packaging, Vol. 117, pp 130–135.Google Scholar
Vaynman, S., McKeown, S. A., 1993, “Energy-Based Methodology for the Fatigue Life Prediction of Solder Materials,” IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 16, No. 3, pp. 317–323.Google Scholar