Hostname: page-component-848d4c4894-mwx4w Total loading time: 0 Render date: 2024-06-20T17:27:21.542Z Has data issue: false hasContentIssue false
  • English
  • Français

Microstructure and Microchemistry of Tungsten and Tungsten Compound Reactions with Aluminum Nitride Substrates

Published online by Cambridge University Press:  21 February 2011

Alistair D. Westwood  and
Michael R. Notis
Alistair D. Westwood
Affiliation:
Department of Materials Science & Engineering, Whitaker Lab #5, Lehigh University, Bethlehem, PA 18015
Michael R. Notis
Affiliation:
Department of Materials Science & Engineering, Whitaker Lab #5, Lehigh University, Bethlehem, PA 18015
Get access

Abstract

A clear understanding of the bonding process in the cofired tungsten-aluminum nitride (W-AIN) metallized system is not currently available. Therefore, in an attempt to obtain a fuller understanding of this process, reactions between metallic W, tungsten trioxide (WO3), and calcium tungstate (CaWO4) with aluminum nitride have been studied using a variety of electron microscopy techniques. The observed reaction was found to be similar in all cases, resulting in the formation of metallic tungsten particles within the AIN substrates. A reaction sequence is proposed to explain adhesion in the W-AIN metallized system; thermodynamic calculations support the proposed reaction sequence. The adhesion in this system is due to both a mechanical fastening by an interlocking and a chemical precipitation reaction. Finally thermal conductivity measurements across the interface have been made to assess the ability of the interface to transfer heat.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 295
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Kuamoto, N., Taniguchi, H. and Aso, I., IEEE Trans. Components Hybrids Manuf. Technol., CHMT–9(4), 386–390 (1986)Google Scholar
2. Werdecker, W., Proceedings ISHM 1985, Stressa/ItalyGoogle Scholar
3. Kluge-weiss, P. and Gobrecht, J., Mat. Res. Soc. Symp. Proc., 40, 399–404 (1985)Google Scholar
4. Iwase, N., Anzai, K., Shinozaki, K., Hirao, O., Thanh, T. Dinh and Sugiura, Y., IEEE Trans. Components Hybrids Manuf. Technol., CHMT–8(2), 253–258 (1985)Google Scholar
5. Kurokawa, Y., Hamaguchi, H., Shimada, Y., Utsumi, K., Kamata, T. and Noguchi, S., Proceedings from the 36th Electronic Components Conference (IEEE), 412–418 (1986)Google Scholar
6. Kurokawa, Y., Toy, C. and Scott, W. D., J. Am. Ceram. Soc., 72(4), 612–616 (1989)Google Scholar
7. Westwood, A. D. and Notis, M. R., to be published in Electronic Packagino Material Science, edited by Lillie, E. D., MRS Spring Meeting San Diego CA, 1989 Google Scholar
8. Borisova, A. L. and Martsenyuk, I. S., Sov. Powder Metall. Met. Ceram., 14(10), 822–826 (1975)Google Scholar
9. Schuster, J. C. and Nowotny, H., J. Mater. Sci., 20, 2787–2793 (1985)Google Scholar
10. Williams, D. B., Practical Analytical Electron Microscopy in Materials Science, (Philips Electronic Instruments. Inc, Electron Optics Publishing Group, Mahwah NJ, 1984) pp.55–90 Google Scholar
11. Enck, R. C., Harris, R. D. and Youngman, R. A., to be published in Ceramic Transactions, Advanced Characterization Techniques for Ceramics, ACerSoc, Westerville OH, 1989 Google Scholar
12. Barin, I. and Knacke, O., Thermochemical Properties of Organic Substances, (Springer Verlag, Berlin 1973)Google Scholar
13. Hudson, A. and Makim, M. J., J. Phys., 3, 311 (1970)Google Scholar
14. Jones, P. M., Rackham, G. M. and Steeds, J. W., Proc. R. Soc. Lond., A354, 197–222 (1977)Google Scholar
15. Waring, J. L., J. Am. Ceram. Soc., 48, 494 (1965)Google Scholar