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Microstructure and Damage of the Interlaminar Interface of Carbon Fiber Polymer-Matrix Composites, Monitored by Contact Electrical Resistivity Measurement

Published online by Cambridge University Press:  17 March 2011

Shoukai Wang ,
Victor H. Guerrero ,
Daniel P. Kowalik  and
D.D.L. Chung
Shoukai Wang
Affiliation:
Composite Materials Research Laboratory, University at Buffalo The State University of New York, Buffalo, NY 14260-4400, U.S.A.
Victor H. Guerrero
Affiliation:
Composite Materials Research Laboratory, University at Buffalo The State University of New York, Buffalo, NY 14260-4400, U.S.A.
Daniel P. Kowalik
Affiliation:
Composite Materials Research Laboratory, University at Buffalo The State University of New York, Buffalo, NY 14260-4400, U.S.A.
D.D.L. Chung
Affiliation:
Composite Materials Research Laboratory, University at Buffalo The State University of New York, Buffalo, NY 14260-4400, U.S.A.
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Abstract

The microstructure and damage of the interlaminar interface of continuous carbon fiber polymer-matrix structural composites were monitored during dynamic changes in temperature, humidity and stress by contact electrical resistivity measurement. The stress was compressive, in the direction perpendicular to the interface. Temperature, humidity and stress had reversible effects on the resistivity, due to the effects on the interfacial microstructure, such as the extent of contact between fibers of adjacent laminae. These parameters had irreversible effects on the resistivity, due to relaxation and damage of the interface. The effects differed between composites with thermoplastic and thermoset matrices. The reversible effects allow the use of the contact resistivity as an indicator of temperature, humidity and stress.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 699: Symposium R – Electrically Based Microstructural Characterization III , 2001 , R9.2
Copyright
Copyright © Materials Research Society 2002

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References

1.ASTM Standard, D 2344-84, 43–45 (1995).Google Scholar
2. Zhou, G., Green, E. R., and Morrison, C., Compos. Sci. Tech. 55(2), 187 (1995).Google Scholar
3. Iyer, S. L., Sivaramakrishnan, C., and Young, C., Proc. 34th Int. SAMPE Symp., (SAMPE, Covina, CA, 1989), pp. 2172–2181.Google Scholar
4. Wang, X. and Chung, D. D. L., Polym. Compos. 18(6), 692 (1997).Google Scholar
5. Selzer, R. and Friedrich, K., Composites - Part A: Applied Science & Manufacturing, 28(6), 595 (1997).Google Scholar
6. Wang, X., Fu, X., and Chung, D. D. L., J. Mater. Res. 14, 790 (1999).Google Scholar
7. Wen, S., Wang, S., and Chung, D. D. L., J. Mater. Sci. 35, 3669 (2000).Google Scholar