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Microscratch Analysis of The Adhesion Failure on Oxide Thin Films With Different Thickness

Published online by Cambridge University Press:  15 February 2011

C. R. Ottermann ,
K. Bange ,
A. Braband ,
H. Haefke  and
W. Gutmannsbauer
C. R. Ottermann
Affiliation:
SCHOTT GLASWERKE, R&D, P.O. Box 24 80, D-55014 Mainz, Germany
K. Bange
Affiliation:
SCHOTT GLASWERKE, R&D, P.O. Box 24 80, D-55014 Mainz, Germany
A. Braband
Affiliation:
SCHOTT GLASWERKE, R&D, P.O. Box 24 80, D-55014 Mainz, Germany
H. Haefke
Affiliation:
CSEM Swiss Centre for Electronics and Microtechnology, Inc., P.O. Box 41, CH-2007 Neuchâtel, Switzerland
W. Gutmannsbauer
Affiliation:
University of Basel, Institute of Physics, Klingelbergstrasse 82, CH-4056 Basel, Switzerland
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Abstract

Adhesion failures of Ti2 and Ta2O5 thin films deposited by reactive evaporation (RE), reactive ion plating (IP) and plasma impulse chemical vapour deposition (PICVD) on fused silica, AF 45, TEMPAX and soda-lime glass substrates are investigated by means of a micro-scratch tester. The oxide films possess thickness between 60 and 500 nm and show different mass densities depending on the deposition conditions. Scratch testing exhibits well pronounced detachment for thicker films on hard substrates. The clearance of the scratch signal is reduced with decreasing layer thickness or for softer substrate materials. The test results are also influenced by the various substrates and different chemical and mechanical properties of the films due to the alternate deposition techniques.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 436: Symposium CC – Thin Films Stresses and Mechanical Properties VI , 1996 , 109
Copyright
Copyright © Materials Research Society 1997

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