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Micro-Raman Evaluation of Polycrystalline Silicon MEMS Devices

Published online by Cambridge University Press:  01 February 2011

Justin R. Serrano ,
Leslie M. Phinney  and
Sean P. Kearney
Justin R. Serrano
Affiliation:
serranoabq@gmail.com, Sandia National Laboratories, Thermal-Fluids-Aero Experimental Sciences Department, P.O. Box 5800, MS 1310, Albuquerque, NM, 87185-1310, United States, (505) 844-0188, (505) 845-8620
Leslie M. Phinney
Affiliation:
lmphinn@sandia.gov, Sandia National Laboratories, Engineering Sciences Center, United States
Sean P. Kearney
Affiliation:
spkearn@sandia.gov, Sandia National Laboratories, Engineering Sciences Center, United States
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Abstract

Micro-Raman spectroscopy is a valuable tool for thermometry of operational polysilicon MEMS devices. By using the temperature-calibrated response of the optical phonon peak of the polysilicon Raman signature and the micron-scale spatial resolution achieved with a 488 nm Ar+ laser Raman probe, we have obtained spatially resolved steady-state thermal profiles of Joule-heated thermal flexure actuators. The measured thermal profiles are further compared to one-dimensional numerical models of the thermal response of the electrically heated devices.

Keywords

Raman spectroscopymicroelectro-mechanical (MEMS)polycrystal
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 890: Symposium Y – Surface Engineering for Manufacturing Applications , 2005 , 0890-Y08-37
Copyright
Copyright © Materials Research Society 2006

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References

REFERENCES

1. Comtois, J. H., Michalicek, M. A., and Barron, C. C., Sensors and Actuators A, 70, 23–31 (1998).Google Scholar
2. Cragun, R. and Howell, L. L., Microeloectromechanical Systems (MEMS), at the 1999 ASME International Mechanical Engineering Congress and Exposition, 181–188, November, 1999.Google Scholar
3. Que, L., Park, J. S., and Gianchandani, Y. B., Journal of Microelectromechanical Systems, 10, 247–254 (2001).Google Scholar
4. Howell, L. L. and Lyon, S. M., U.S. Patent No. 6,734,597, issued May 11, 2004.Google Scholar
5. Baker, M. S., Plass, R. A., Headley, T. J., and Walraven, J. A., Sandia National Laboratories, Albuquerque, NM and Livermore, CA SAND2004–6635 (2004)Google Scholar
6. Guckel, H., Klein, J., Christenson, T., Skrobis, K., Laundon, M., and Lovell, E. G., IEEE Solid State Sensor and Actuator Workshop, 73–75 (1992).Google Scholar
7. Comtois, J. H. and Bright, V. M., Sensors and Actuators A, 58, 9–25 (1997).Google Scholar
8. Comtois, J. H., Michalicek, M. A., and Barron, C. C., 1997 International Conference on Solid-State Sensors and Actuators, 769–772, Chicago, 1997.Google Scholar
9. Huang, Q. A. and Lee, N. K. S., Journal of Micromechanics and Microengineering, 9, 64–70 (1999).Google Scholar
10. Huang, Q. A. and Lee, N. K. S., Microsystem Technologies, 5, 133–137 (1999).Google Scholar
11. Kuang, Y., Huang, Q. A., and Lee, N. K. S., Microsystem Technologies, 8, 17–21 (2002).Google Scholar
12. Lott, C. D., McLain, T. W., Harb, J. N., and Howell, L. L., Sensors and Actuators A, 101, 239–250 (2002).Google Scholar
13. Hart, T. R., Aggarwal, R. L., and Lax, B., Physical Review B, 1, 638–642 (1970).Google Scholar
14. Tsu, R. and Hernandez, J. G., Applied Physics Letters, 41, 1016–1018, (1982).Google Scholar
15. Balkanski, M., Wallis, R. F., and Haro, E., Physical Review B, 28, 1928–1934, (1983).Google Scholar
16. Ostermeir, R., Brunner, K., Absteiter, G., and Weber, W., IEEE Transactions on Electron Devices, 30, 858–863 (1992).Google Scholar
17. Abel, M. R., Wright, T. L., Sunden, E. O., Graham, S., and King, W. P., Proceedings of the 21st IEEE SEMI-THERM Symposium, San Jose, CA, 2005.Google Scholar
18. Abel, M. R. and Graham, S., Proceedings of ASME InterPack2005, IPACK2005–73088, 1–8, (2005).Google Scholar
19. Kearney, S. P., Phinney, L. M., and Baker, M. S., Journal of Microelectromechanical Systems, In press, 2005.Google Scholar
20. Abel, M. R., Graham, S., Serrano, J. R., Kearney, S. P., and Phinney, L. M., (unpublished).Google Scholar
21. Sniegowski, J. J. and Boer, M. P. d., Annual Reviews of Materials Science, 30, 299–333 (2000).Google Scholar
22. Zhang, Z. M., Annual Review of Heat Transfer, vol. 11, Tien, C.-L., ed. New York: Begell House, Inc., 2000, pp. 351–411.Google Scholar
23. Bowden, M. and Gardiner, D. J., Internet Journal of Vibrational Spectroscopy, 2 (1998).Google Scholar