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Micromechanical Tensile Testing

Published online by Cambridge University Press:  15 February 2011

S. Greek ,
F. Ericson ,
S. Johansson  and
J.-Å. Schweitz
S. Greek
Affiliation:
Materials Science, Uppsala University, Box 534, S-751 21 Uppsala, Sweden, Staffan.Greek@teknikunm.uu.se
F. Ericson
Affiliation:
Materials Science, Uppsala University, Box 534, S-751 21 Uppsala, Sweden, Staffan.Greek@teknikunm.uu.se
S. Johansson
Affiliation:
Materials Science, Uppsala University, Box 534, S-751 21 Uppsala, Sweden, Staffan.Greek@teknikunm.uu.se
J.-Å. Schweitz
Affiliation:
Materials Science, Uppsala University, Box 534, S-751 21 Uppsala, Sweden, Staffan.Greek@teknikunm.uu.se
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Abstract

A method is described where tensile tests can be performed in situ on micromachined structures. The testing equipment consists of a testing unit mounted on a micromanipulator in a Scanning Electron Microscope (SEM). The fracture loads of micromachined beam structures made from thick and thin film polysilicon as well as from electrodeposited nickel and nickeliron alloy were measured, and the fracture strengths then calculated via measurements of the test structures’ initial cross-sectional areas. The statistical scatter of the polysilicon fracture strength values were evaluated by Weibull statistics. The mean fracture strength and the Weibull modulus, a measure of the scatter, were obtained

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 436: Symposium CC – Thin Films Stresses and Mechanical Properties VI , 1996 , 227
Copyright
Copyright © Materials Research Society 1997

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