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Microelectronic Film Thickness Determination Using a Laserbased Ultrasonic Technique

Published online by Cambridge University Press:  15 February 2011

R. Logan ,
A. A. Maznev ,
K. A. Nelson ,
J. A. Rogers ,
M. Fuchs  and
M. Banetv
R. Logan
Affiliation:
Department of Chemistry, Massachusetts Institute of Technology, Cambridge, MA 02139
A. A. Maznev
Affiliation:
Department of Chemistry, Massachusetts Institute of Technology, Cambridge, MA 02139
K. A. Nelson
Affiliation:
Department of Chemistry, Massachusetts Institute of Technology, Cambridge, MA 02139
J. A. Rogers
Affiliation:
Department of Chemistry, Harvard University, Cambridge, MA 02139
M. Fuchs
Affiliation:
Active Impulse Systems, 12 Michigan Drive, Natick, MA 01760
M. Banetv
Affiliation:
Active Impulse Systems, 12 Michigan Drive, Natick, MA 01760
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Abstract

A non-contact and non-destructive laser-based acoustic technique called impulsive stimulated thermal scattering (ISTS) is used to measure thicknesses of films in single-layer and multilayer assemblies such as W/Si, Ti/Si, and Ti/SiO2/Si structures. Thicknesses are determined to within a few percent accuracy with a laboratory version of the measurement apparatus, using conventional large-frame lasers and optics, and in a commercial prototype using compact diode-pumped and diode lasers and optics which all fit onto a 1-ft × 2-ft breadboard. ISTS and conventional measurements (profilometry, SEM, and 4-point resistance) are made on the same samples and the results are found to compare favorably.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 440: Symposia CA – Structure and Evolution of Surfaces , 1996 , 347
Copyright
Copyright © Materials Research Society 1997

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References

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