Hostname: page-component-8448b6f56d-qsmjn Total loading time: 0 Render date: 2024-04-19T20:04:26.011Z Has data issue: false hasContentIssue false
  • English
  • Français

A Method for Making Elastic Metal Interconnects

Published online by Cambridge University Press:  15 February 2011

Joyelle Jones ,
Stéphanie Périchon Lacour ,
Sigurd Wagner  and
Zhigang Suo
Joyelle Jones
Affiliation:
Departments of Electrical and Mechanical and Aerospace Engineering, Princeton University, Princeton, NJ 08540
Stéphanie Périchon Lacour
Affiliation:
Departments of Electrical and Mechanical and Aerospace Engineering, Princeton University, Princeton, NJ 08540
Sigurd Wagner
Affiliation:
Departments of Electrical and Mechanical and Aerospace Engineering, Princeton University, Princeton, NJ 08540
Zhigang Suo
Affiliation:
Departments of Electrical and Mechanical and Aerospace Engineering, Princeton University, Princeton, NJ 08540
Get access

Abstract

Stretchable, elastic metal interconnects are a key to the fabrication of 3-D conformal circuits and electrotextiles. The basic concept for reversibly stretchable, elastic metallization is a corrugated stripe of thin-film metal that is expanded by stretching. The maximum elongation is reached when the stripe is stretched flat. We prepared wavy metal stripes by evaporating gold onto pre-stretched strips of the elastomer, poly-dimethyl siloxane (PDMS). We experimented with gold metal line width and thickness and substrate elongation. We measured the film structure, amplitude, and wavelength, as well as electrical resistance in relaxed and various stretched states. So far we have reached elastic strains of 15% while maintaining the initial resistance and 80% with a rise in the resistance. We discovered a rich macroscopic and microscopic film morphology. Presented are the fabrication, electro-mechanical performance, and data on the film structure of these wavy metal interconnects.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 769: Symposium H – Flexible Electronics - Materials and Device Technology , 2003 , H6.12
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Huang, H. and Spaepen, F., Acta mater. 48, 3261 (2000).Google Scholar
2. Lacour, Stephanie Perichon, Wagner, Sigurd, Huang, Zhenyu, Suo, Z. Appl. Phy. Letters, 82, 2404 (2003)Google Scholar
3. Watanabe, Masashi, Shirai, Hirofusa, and Hirai, Toshihiro, J. Appl. Phys. 92, 4631 (2002).Google Scholar
4. Chambers, Catriona, Lacour, Stephanie Perichon, Wagner, Sigurd, Suo, Z., Mat. Res. Soc. Symp. Proc. H10.3 Spring (2003)Google Scholar