Hostname: page-component-8448b6f56d-dnltx Total loading time: 0 Render date: 2024-04-25T04:17:43.106Z Has data issue: false hasContentIssue false
  • English
  • Français

Mechanical Stress and Electromigration Failure

Published online by Cambridge University Press:  15 February 2011

J. R. Lloyd
J. R. Lloyd*
Affiliation:
Digital Equipment Corp., Hudson MA, 01749–2809
Get access

Abstract

The role of mechanical stress in electromigration failure morphology and time to failure is discussed theoretically. It is seen that a tensile stress can accelerate failure significantly and that accelerations from test conditions are also a function of applied stress.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 225: Symposium G – Materials Reliability Issues in Microelectronics , 1991 , 47
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1) Ainslee, N.G., D'Heurle, F.M., and Wells, O.C., Appl. Phys. Lett., 20, 173 (1972)Google Scholar
2) Blech, I.A. and Herring, C., Appl. Phys. Lett., 29, 131 (1976)Google Scholar
3) Lloyd, J.R. and Smith, P.M., J. Vac. Sci. Technol. A 1, 455 (1983)Google Scholar
4) Sanchez, J.E. Jr., McKnelly, L.T. and Morris, J.W. Jr., J. Electron. Mater. 19, 1213 (1990)Google Scholar
5) Shatzkes, M. and Lloyd, J.R., J. Appl. Phys., 59, 3890 (1986)Google Scholar
6) Ohring, M., J. Appl. Phys., 42, 2653 (1971)Google Scholar
7) Ohring, M., Mater. Sci. Eng.,7, 158 (1971)Google Scholar
8) Lloyd, J.R., J. Appl. Phys., 69, 7601 (1991)Google Scholar
9) Attardo, M.J., Rutledge, R., and Jack, R.C., J. Appl. Phys., 42, 4343 (1971)Google Scholar
10) Cuddihy, E.F., Lawton, R.A., and Gavin, T.R., IEEE Trans. Reliab., 39, 564 (1990)Google Scholar
11) Kwok, T., Chan, K.K., Chan, H. and Simko, J., To be published in J. Appl. Phys. July/August 1991 Google Scholar
12) Lloyd, J.R., Smith, P.M. and Prokop, G.S., Thin Solid Films, 93, 385 (1982)Google Scholar
13) For instance see Blech, I.A. and Meiren, E.S., Appl. Phys. Lett., 11, 263 (1967) or M. Ohring and P.H. Sun, J. Vac. Sci. Technol., 9, 284 (1971)Google Scholar