Hostname: page-component-8448b6f56d-dnltx Total loading time: 0 Render date: 2024-04-16T06:51:45.771Z Has data issue: false hasContentIssue false
  • English
  • Français

Mechanical Characterization of Photoresist Polymer Coatings as a Function of Processing History

Published online by Cambridge University Press:  26 February 2011

Kun Tong ,
Jeffery F. Taylor  and
Richard J. Farris
Kun Tong
Affiliation:
Polymer Science and Engineering Department, University of Massachusetts, Amherst, MA 01003
Jeffery F. Taylor
Affiliation:
Polymer Science and Engineering Department, University of Massachusetts, Amherst, MA 01003
Richard J. Farris
Affiliation:
Polymer Science and Engineering Department, University of Massachusetts, Amherst, MA 01003
Get access

Abstract

Photoresist polymer coatings in the film-substratum systems usually generate selfinduced residual stress during processing. It is believed that the residual stress is the driving force for buckling, cracking and delamination of the polymer coatings. Analysis of the residual stress development during processing is of great interest and practical importance.

Holographic interferometry technique has been developed for the direct measurements of general 2-dimensional stresses in thin films.[l] It turns out that it is a powerful technique to analyze residual stress development in polymer coatings during processing. By directly measuring the residual stress for each processing stage, the history of residual stress evolution can be closely followed and the residual stresses generated from different origins can be separated. By varying UV curing dosage, thermal curing temperature and the sequence of thermal and UV curing procedures, different residual stresses from various processing conditions can be comprehensively analyzed. Combining these data with mechanical properties of the coating offers valuable information for better understanding of the processing mechanism and enables one to optimize processing conditions for the best product capability.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 109
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Maden, M. A., Jagota, A., Masur, S. and Farris, R. J., Vibrational Technique for Stress Measurement in Films I. Ideal membrane Behavior. (Submitted to Journal of Materials Research for publication, 1991).Google Scholar
[2] Rosen, S. L., Fundamental Principles of polymeric Materials. (John Wiley & Sons, New York, 1982).Google Scholar
[3] Reiser, A., Photoreactive Polymers. (John Wiley & Sons, New York, 1989)Google Scholar
[4] Htoo, M. S., Microelectronic Polymers, (Marcel Dekker, Inc., New York and Basel, 1989).Google Scholar
[5] Tong, K., Maden, M. A., Jagoda, A. and Farris, R. J., Vibrational Technique for Stress Measurement in Films - 2. Extensions and complicating effects. (Submitted to Journal of Materials Research for publication, 1991).Google Scholar
[6] Maden, M. A., Tong, K. and Farris, R. J., Measurement of Stresses in Thin Films Using Holographic Interferometry: Dependence on Atmospheric Conditions. Mat. Res. Soc. Symp. Proc., 188, 29–34 (1990).Google Scholar