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Mechanical Bending Fatigue Reliability and Its Application to Area Array Packaging

Published online by Cambridge University Press:  21 March 2011

Andrew F. Skipor  and
Larry Leicht
Andrew F. Skipor
Affiliation:
Motorola Labs, Motorola Advanced Technology Center, 1301 E. Algonquin Rd., Schaumburg, IL 60196, U.S.A
Larry Leicht
Affiliation:
Motorola, Personal Communications Sector, Component Interconnect Technology Center, 1900 Winchester Road, Libertyville, IL 60048, U.S.A
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Abstract

Fine pitch area array packages are often assembled to flexible printed circuit boards, which require numerous low-frequency mechanical deflections. The interconnect package reliability emphasis has become focused more on isothermal bending fatigue. The interconnect failures due to bending fatigue were found to be different than those which occur if the packages were subjected to accelerated temperature cycling. A test method has been developed to evaluate isothermal mechanical bending fatigue reliability of area array packaging. Mechanical fatigue results of 1.0, 0.8, and 0.75 mm pitch packaging will be presented, demonstrating the effect of package substrate material properties on fatigue life and fracture morphology. Numerical finite element analysis results will also be presented to support and expand the findings in this study.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 682: Symposium N – Microelectronics and Microsystems Packaging , 2001 , N5.6
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

1. Wild, R., “Some Fatigue Properties of solders and solder Joints,” InterNepcon, Oct. 1975.Google Scholar
2. Solomon, H., “Fatigue of 60/40 Solder,” IEEE Trans. Comp. Hybrids Manuf. Technol., Vol. CHMT–9, 1986, pp. 423–432.Google Scholar
3. Brown, V. L., Lach, L. E., and Leicht, J. L., “A New Land Grid Array Package Family: An Industry Standard High Pin-Out Packaging Concept,” Proceedings of the 1992 IEPS, Austin Texas, Sept. 30, pp. 310–340.Google Scholar
4. Darveaux, R. and Mawer, A., “Thermal and Power Cycling Limits of Plastic Ball Grid Array (PBGA) Assemblies,” Surface Mount Int'l., San Jose, August 29-31, 1995, pp. ”315–326.Google Scholar
5. Skipor, A. F., Harren, S. V., and Botisis, J., “On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder,” ASME J. of Engineering Materials Technology, Vol. 118, January 1996, pp. 1–11.Google Scholar
6. Leicht, Larry and Skipor, Andrew, “Mechanical Cycling Fatigue of PBGA Package Interconnects,” IMAPS Conf., San Diego, Ca, 1998, pp. 802–807.Google Scholar
7 Harvey, Ian R., Turner, David, Ortowski, Jim, and Herbert, Jim, “Strategy for Characterizing and Minimizing Effects of Tensile Stress in CSP's as Induced by Board Flexure,” Boston IMAPS Conference, Sept. 20-22, 2000, pp. 1–8.Google Scholar
8 Wu, J. D., Ho, S. H., Zheng, P. J., Liao, C. C., and Hung, S. C., “An Experimental Study of Failure and Fatigue Life of a Stacked CSP Subjected to Cyclic Bending,” Electronic Components and Technology Conference, May 2001, Orlando, Florida.Google Scholar
9. www.mts.com.Google Scholar
10. www.ansys.com.Google Scholar
11. ANSYS™ Theory Reference, version 5.6, Chapter 4, Structures with Material Nonlinearities.Google Scholar
12. Brown, Eric and Sottos, Nancy, “Thermo-elastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications,” UIUC TAM Report No. 878, UILU-ENG-98-6004, February 1998.Google Scholar
13. Timoshenko, S. and Woinowski-Krieger, S., Theory of Plates and Shells, McGraw-Hill (New York, 1987), pp. 51–111.Google Scholar