Hostname: page-component-7bb8b95d7b-495rp Total loading time: 0 Render date: 2024-09-23T19:31:23.073Z Has data issue: false hasContentIssue false
  • English
  • Français

Measurement of Ultrathin Film Mechanical Properties by Integrated Nano-scratch/indentation Approach

Published online by Cambridge University Press:  01 February 2011

Ashraf Bastawros ,
Wei Che  and
Abhijit Chandra
Ashraf Bastawros
Affiliation:
bastaw@iastate.edu, Iowa State University, Aerospace Engineering, 2271 Howe Hall, Rm 1200, Ames, IA, 50011-2271, United States, 515-294-3039, 515-294-3262
Wei Che
Affiliation:
wei.che@saint-gobain.com, Saint Gobain, Inc., Boston, MA, 01606, United States
Abhijit Chandra
Affiliation:
achandra@iastate.edu, Iowa State University, Mechanical Engineering, Ames, IA, 50011, United States
Get access

Abstract

The thickness and property measurements of thin films on a substrate are crucial for a wide range of applications. Classical techniques have relied on various physical properties to identify film thickness, independent of its mechanical properties. Here, a new experimental technique is devised to evaluate the film thickness, its stiffness and its flow stress. The technique utilizes the variation of the measured apparent modulus of a ductile film on a substrate from a nano-indentation experiment, in conjunction with the measured normal and tangential forces and the scratch depth in a nano-scratch experiment. These combined measurements are calibrated through a simple statically admissible model to yield the unknown quantities. The measurements reasonably agree with the finite element predictions and are ascertained by XPS film thickness measurements. The technique is applied to study the formed oxide nano-layer during copper chemical mechanical planarization process.

Keywords

thin filmelastic propertiesstrength
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1049: Symposium AA – Fundamentals of Nanoindentation and Nanotribology IV , 2007 , 1049-AA04-04
Copyright
Copyright © Materials Research Society 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Steigerwald, J.M., Murarka, S.P., Gutmann, R.J., Duquette, D.J., Materials Chemistry and Physics, v 41, n 3, Aug 1995, p 217.Google Scholar
2 Flinn, P.A., Gardner, D.S., Nix, W.D., IEEE Transactions on Electron Devices, v ED–34, n 3, Mar, 1987, p 689–699.Google Scholar
3 Anderson, A.P., Devries, K.L., Williams, M.L., Int. J. Fract. 10 (1974), p. 565.Google Scholar
4 Tsui, T.Y., Ross, C. A.; Pharr, G. M., Materials Research Society Symposium - Proceedings, v 473, Materials Reliability in Microelectronics VII, 1997, p 57–62.Google Scholar
5 Tsui, T. Y., Pharr, G. M., Journal of Materials Research, v 14, n 1, Jan, 1999, p 292–301.Google Scholar
6 Weisenberger, L.M., DurKin, B.J., Copper Plating, Electroplating, pp 167–175, McGraw-Hill, 1978.Google Scholar
7 Gignac, L.M., Rodbell, K.P., Cabral, C. Jr., Andricacos, P.C., Rice, P.M., Beyers, R.B., Locke, P.S., Klepeis, S.J., Materials Research Society Symposium - Proceedings, v 562, 1999, p 209–214.Google Scholar
8 Chawla, S. K., Rickett, B. I., Sankarraman, N., Payer, J. H.,Corrosion Science, Vol. 33, No. 10, 1992, p1617–1631.Google Scholar
9 Che, W., PhD Thesis, Iowa State University, Ames, IA, 2005.Google Scholar
10 Saha, R., Nix, W.D., Acta Materialia, v 50, n 1, Jan 2002, p 23–38.Google Scholar
11 Mesarovic, S.D., Fleck, N.A., International Journal of Solids and Structures, v 37, n 46, Nov 2000, p 7071–7091.Google Scholar
12 Oliver, W.C., Pharr, G.M., J Mater Res, 7, 1992, p1564.Google Scholar