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Material Properties and Process Compatibility of Spin-on Nano-foamed Polybenzoxazole for Copper Damascene Process

Published online by Cambridge University Press:  11 February 2011

Takashi Enoki
Affiliation:
Fundamental Research Laboratory, Research Department, Sumitomo Bakelite Co., Ltd., 495, Akiba-cho, Totsuka-ku, Yokohama, 245–0052, Japan
Kenzo Maejima
Affiliation:
Fundamental Research Laboratory, Research Department, Sumitomo Bakelite Co., Ltd., 495, Akiba-cho, Totsuka-ku, Yokohama, 245–0052, Japan
Hidenori Saito
Affiliation:
Fundamental Research Laboratory, Research Department, Sumitomo Bakelite Co., Ltd., 495, Akiba-cho, Totsuka-ku, Yokohama, 245–0052, Japan
Akifumi Katsumura
Affiliation:
Fundamental Research Laboratory, Research Department, Sumitomo Bakelite Co., Ltd., 495, Akiba-cho, Totsuka-ku, Yokohama, 245–0052, Japan
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Abstract

We have developed nano-foamed OxD which has good properties such as dielectric constant=2.2, homogeneous distributed nano pores, smooth surface based on polybenzoxazole chemistry and nano-foaming technology. The nano-foamed OxD also has excellent thermal stability, chemical stability and etching property. The developed nano-foamed OxD is one of good candidates for copper damascene structure to achieve shrinking dimensions of future semi-conductor devices.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

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References

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