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Low Temperature Oxidation and Spalling of Electrodeposited and Vapour-Deposited Copper

Published online by Cambridge University Press:  26 February 2011

Robert M. Fisher ,
Bret Martin  and
Rowland M. Cannon
Robert M. Fisher
Affiliation:
Center For Advanced Materials, Lawrence Berkeley Laboratory, University of California, Berkeley, Ca. 94720
Bret Martin
Affiliation:
Center For Advanced Materials, Lawrence Berkeley Laboratory, University of California, Berkeley, Ca. 94720
Rowland M. Cannon
Affiliation:
Center For Advanced Materials, Lawrence Berkeley Laboratory, University of California, Berkeley, Ca. 94720
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Abstract

Thermal cycling of silicon solar cells heated with incandescent light or using an in-situ heating stage on an optical microscope caused unexpectedly rapid oxidation of the electrodeposited copper current collecting grid. Unusually fine buckling and spal ling of the oxide film also occurred at temp. as low as 180°C. These effects appear to stem from the very fine columnar grains and high defect content of the copper ribbons and some Cl residue from the electrolyte. With vapour-deposited Cu, similar relatively rapid oxidation and spalling were also observed. Origins of the high oxidation rates, the large compressive stresses within the oxide and the low-temperature spalling are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 54: Symposium E – Thin Films–Interfaces and Phenomena , 1985 , 829
Copyright
Copyright © Materials Research Society 1986

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References

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