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Location-Controlled Large-Grains in Near-Agglomeration Excimer-Laser Crystallized Silicon Films

Published online by Cambridge University Press:  14 March 2011

Paul Ch. van der Wilt
Affiliation:
Delft Institute of Microelectronics and Submicron Technology (DIMES), P.O. box 5053, 2600 GB Delft, The, Netherlands
Ryoichi Ishihara
Affiliation:
Delft Institute of Microelectronics and Submicron Technology (DIMES), P.O. box 5053, 2600 GB Delft, The, Netherlands
Jurgen Bertens
Affiliation:
Delft Institute of Microelectronics and Submicron Technology (DIMES), P.O. box 5053, 2600 GB Delft, The, Netherlands
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Abstract

Large grains in thin silicon films were grown by controlling the location of unmolten islands, which are left after near-complete melting of the film during excimer laser crystallization. As the initially amorphous film was first transformed in small grain polycrystalline silicon, these islands contain seeds for crystal growth. To get a single large grain, either the number of seeds was reduced to one or a single one was selected from the seeds by a ‘grain filter’. Former was achieved by making a small indentation in the isolating layer underlying the silicon film so that seeds remain embedded in the indentation. Latter was achieved by making a small diameter hole in the underlying isolating layer, which was filled with amorphous silicon. The lateral growth is preceded by a vertical growth phase during which a single grain is filtered from the initial set of seeds present at the bottom of the hole. In the experiment described, highest yield was achieved for samples in which the melt-depth to hole- diameter ratio was largest.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1. Ishihara, R. and Matsumura, M., Jpn. J. Appl. Phys. 36 (1997) 6167.Google Scholar
2. Im, J. S., Kim, H. J., and Thompson, M. O., Appl. Phys. Lett. 63 (1993) 1969.Google Scholar
3. Im, J. S., Sposili, R. S., and Crowder, M. A., Appl. Phys. Lett 70 (1997) 3434.Google Scholar
4. Wilt, P. Ch. van der and Ishihara, R., Solid State Phenomena 67–68 (1999) 169.Google Scholar
5. Oh, C.-H. and Matsumura, M., Jpn. J. Appl. Phys. 37 (1998) 5474.Google Scholar
6. Wilt, P. Ch. van der and Ishihara, R., to be submitted to Appl. Phys. Lett.Google Scholar
7. Sze, S. M., VLSI Technology (McGraw-Hill Book Co., New York, USA) 2nd ed. (1988) 223.Google Scholar
8. Watanabe, H., Miki, H., Sugai, S., Kawasaki, K., and Kioka, T., Jpn. J. Appl. Phys. 33 (1994) 4491.Google Scholar
9. Sze, S. M., VLSI Technology (McGraw-Hill Book Co., New York, USA) 2nd ed. (1988) 253.Google Scholar
10. Kuriyama, H. et al. , Jpn J. Appl. Phys. 30 (1991) 3700.Google Scholar