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Integrated Optical Isolator Employing Nonreciprocal Phase Shift by Wafer Direct Bonding

Published online by Cambridge University Press:  10 February 2011

H. Yokoi  and
T. Mizumoto
H. Yokoi
Affiliation:
Department of Physical Electronics, Tokyo Institute of Technology, Tokyo, JAPAN, hyokoi@o.cc.titech.ac.jp
T. Mizumoto
Affiliation:
Department of Physical Electronics, Tokyo Institute of Technology, Tokyo, JAPAN
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Abstract

A novel configuration of an integrated optical isolator employing a nonreciprocal phase shift is proposed. The isolator is equipped with a cladding layer of magnetic garnets by means of wafer direct bonding technique. This device has a semiconductor guiding layer, so high compatibility in integrating with other semiconductor optical devices is expected.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 517: Symposium F – Wide Bandgap Semiconductors for High Power, High Frequency , January 1998 , 469
Copyright
Copyright © Materials Research Society 1998

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