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Influence of Nodulizer Type on the Quality of Solder Ball
Published online by Cambridge University Press: 31 January 2011
Abstract
A solder ball is the key material of the bump fabrication in the BGA and μBGA high integrated packaging. The nodulizer type is the main factor to affect the quality of the solder ball. In the paper the solder balls are fabricated by the fine wire cutting–remelting method. The influence of different nodulizers on the real sphericity and the surface appearance of the solder balls are investigated. Results show that, the real sphericity of the 63Sn37Pb solder balls is maximum and the surface quality of the solder balls is the best compared with the engine oil, heavy oil and silicon oil when the arachis oil is used as the nodulizer.
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- Copyright © Materials Research Society 2009
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