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Influence of Film Thickness and Capping Layer on the Mechanical Properties of Copper Films
Published online by Cambridge University Press: 15 February 2011
Abstract
Substrate curvature and X-ray technique were used to study the mechanical properties of Cu films. Stress-temperature curves were measured using both methods. An additional analysis of the X-ray peak width allows us to estimate grain size and dislocation density as a function of temperature. It can be shown that a capping layer changes the mechanical properties of a Cu film strongly and that in capped films dislocation processes seem to be more important than diffusion at high temperatures.
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- Copyright © Materials Research Society 1995
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