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Influence of Film Thickness and Capping Layer on the Mechanical Properties of Copper Films

Published online by Cambridge University Press:  15 February 2011

R.-M. Keller ,
W.-M. Kuschke ,
A. Kretschmann ,
S. Bader ,
R.P. Vinci  and
E. Arzt
S. Bader
Affiliation:
Max-Planck-Institut für Metallforschung and University of Stuttgart
R.P. Vinci
Affiliation:
now at HP Integrated Circuit Business Division, Corvallis, OR 97330 Department of Materials Science and Eng., Stanford University, Stanford, CA 94305-2205
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Abstract

Substrate curvature and X-ray technique were used to study the mechanical properties of Cu films. Stress-temperature curves were measured using both methods. An additional analysis of the X-ray peak width allows us to estimate grain size and dislocation density as a function of temperature. It can be shown that a capping layer changes the mechanical properties of a Cu film strongly and that in capped films dislocation processes seem to be more important than diffusion at high temperatures.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 391: Symposium T – Materials Reliability in Microelectronics V , 1995 , 309
Copyright
Copyright © Materials Research Society 1995

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