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Improved Methods and Novel Techniques for Jet Electropolishing of TEM Foils*

Published online by Cambridge University Press:  16 February 2011

Bernard J. Kestel*
Affiliation:
Materials Science Division, Argonne National Laboratory, 9700 South Cass Avenue, Argonne, IL 60439
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Abstract

Experience has shown that the difficulties encountered in jet polishing of TEM foils can be minimized by the selection of equipment and an electrolyte appropriate for each material. The use of a jet polishing instrument for more than one type of specimen preparation after minor modification will be presented. Some insights on the relationship and manipulation of the parameters involved in achieving well polished TEM foils having appropriate surface quality, thin area, and perforation size will be included. Methods used to develop new electrolytes for specific purposes and the results of their use on both conventional and superconducting materials will be shown. A technique to calibrate equipment for more reproducible specimen hole size, use of new electrolytes on various materials, the salvage of unsatisfactory foils, and thinning of undersized specimens will be reviewed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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Footnotes

*

Work supported by the U. S. Department of Energy, BES-Materials Sciences, under Contract W-31-109-Eng-38.

References

REFERENCES

[1] South Bay Technology, Inc., 1120 Bia Callejon, San Clemente, CA 92720.Google Scholar
[2] Microshield lacquer.Tolber Division, Pyramid Plastics, Inc., 220 West 5th Street, Hope, Arkansas 71801. (Part of Michigan Chrome and Chemical Co.)Google Scholar
[3] Aremco Products, Inc. P. O. Box 429, Ossining, New York 10562.Google Scholar
[4] Kestel, B. J., Polishine Methods for Metallic and Ceramic Transmission Electron Microscopy Specimens, Report ANL 80–120, Rev. 1 (1986).Google Scholar
[5] Kestel, B. J., Techniques for Achieving Reproducible Shutoff During Jet Thinning of TEM Specimens, EMSA Bulletin, May 1987.Google Scholar
[6] Kestel, B. J., Improved Retention of Precipitates in Stainless Steels, Ultramicroscopy 12, 213216 (1986).Google Scholar
[7] Kestel, B. J., Technique for Jet-Thinning Aged Iron-Chromium Alloys for TEM, Ultramicroscopy 25, 8990 (1986).Google Scholar
[8] Kestel, B. J., Technique for Preparation of TEM Foils from Two-Phase Uranium Silicide, Ultramicroscopy 25, 9192 (1988).Google Scholar
[9] Prud'Homme, M., Pieraggi, B., Poujardieu, J., and Dabosi, F., Thin Foil Preparation of Mg-Li Alloys Using a Non-Aqueous Electrolyte, Metallographyj 5, 459461 (1972).Google Scholar
[10] Schober, T. and Sorajic', V., A New Method for Electropolishing Niobium for Transmission Electron Microscopy, Metallography 6, 183184 (1973).Google Scholar
[11] Kestel, B. J., Jet Thinning of YBa2Cu3Ox.High Tc Superconductor and Also Gold for TEM with a Non-Acid Electrolyte, Ultramicroscopy 25, 351354(1988).Google Scholar
[12] Kestel, B. J., A Jet Electropolishing Solution for Silicon. Germanium. Tantalum. Niobium. and Tungsten-Rhenium, Ultramicroscopy 9, 379384 (1982).Google Scholar
[13] Acufine Inc., 5441 North Kedzie Avenue, Chicago, Illinois 60625.Google Scholar