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High Performance Silicone Gel as IC Device Chip Protection

Published online by Cambridge University Press:  21 February 2011

C. P. Wong
C. P. Wong*
Affiliation:
AT&T Engineering Research Center, Princeton, New Jersey 08540
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Abstract

Recent advances in IC device encapsulants and polymeric materials have made high reliability VLSI plastic packaging a reality. High performance silicone gel possesses excellent electrical and physical properties for IC protection. With their intrinsic low modulus and soft gel-like nature, silicone gels have become very effective encapsulants for the delicate larger chip size and wire-bonded VLSI chips. Recent studies indicate that adequate IC chip surface protection with high performance silicone gels in plastic packaging could possibly replace conventional ceramic: hermetic packaging. This paper will review some potential IC encapsulants. Special focus will be placed on the high performance silicone gel, its chemistry, and its application as a VLSI device encapsulant.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 175
Copyright
Copyright © Materials Research Society 1988

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References

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