Hostname: page-component-788cddb947-t9bwh Total loading time: 0 Render date: 2024-10-13T20:37:52.406Z Has data issue: false hasContentIssue false

Growth and Characterization of Erbium Silicides Synthesized by Metal Vapor Vacuum Arc Ion Implantation

Published online by Cambridge University Press:  17 March 2011

X. W. Zhang
Affiliation:
Department of Electronic Engineering, The Chinese University of Hong Kong, Shatin, N. T., Hong Kong, P. R. China
W. Y. Cheung
Affiliation:
Department of Electronic Engineering, The Chinese University of Hong Kong, Shatin, N. T., Hong Kong, P. R. China
S. P. Wong
Affiliation:
Department of Electronic Engineering, The Chinese University of Hong Kong, Shatin, N. T., Hong Kong, P. R. China
Get access

Abstract

Erbium atoms were implanted into p-type Si (111) wafers at an extraction voltage of 60 kV to doses ranging from 5×1016 to 2×1017 cm−2 using a metal vapour vacuum arc (MEVVA) ion source. The implantation was performed with beam current densities from 3 to 26 µA/cm2 corresponding to substrate temperatures ranging from 85 to 245°C. The characterization of the as-implanted and annealed samples was performed using Rutherford backscattering spectrometry, atomic force microscopy and x-ray diffraction. To determine the sputtering yield, masked implantation experiments were performed so that the thickness of the sputtered layer at different substrate temperatures can be obtained directly by an α-step surface profiler. The results showed that ErSi2-xwas directly formed by MEVVA implantation when the substrate temperature was higher than about 160°C. The effects of the implant dose and the beam current density on the retained dose, the sputtering yield and the surface morphology of the implanted samples were also studied.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Duboz, J. Y., Badoz, P. A., d'Avitaya, F. Arnaud and Chroboczek, J. A., Appl. Phys. Lett. 55, 84 (1989).Google Scholar
2. Grimaldi, M. G., Yan, X. S., Scerra, G., Ravesi, S. and Spinella, C., Appl. Phys. Lett. 67, 974 (1995).Google Scholar
3. Kaltsas, G., Travlos, A., Salamouras, N., Nassiopoulos, A. G., Revva, P. and Traverse, A., Thin Solid Films 275, 87 (1996).Google Scholar
4. Gunnella, R., Veuillen, J. Y., Tan, T. A. Nguyen and Flank, A. M., Phys. Rev. B57, 4154 (1998).Google Scholar
5. Wu, M. F., Vantomme, A., Pattyn, H. and Langouche, G., Appl. Phys. Lett. 67, 3886 (1995).Google Scholar
6. Hogg, S. M., Vantomme, A., Wu, M. F. and Langouche, G., Microele. Engin. 50, 211 (2000).Google Scholar
7. Brown, I.G., Gavin, J. E. and MacGill, R. A., Appl. Phys. Lett. 47, 358 (1985).Google Scholar
8. Peng, Q., Wong, S.P., Wilson, I.H., Wang, N., Fung, K.K., Thin Solid Films 270, 573 (1995).Google Scholar
9. Liu, B. X., Gao, K. Y. and Zhu, H. N., J. Vac. Sci. Technol. B17, 2277 (1999).Google Scholar
10. Brown, I. G. and Godechot, X., IEEE Trans. Plasma Sci. 19, 713 (1991).Google Scholar
11. Thompson, R. D. and Tu, K. N., Thin Solid Films 93, 265 (1982).Google Scholar
12. Ziegler, J. F., Biersack, J. P. and Littmark, U., The Stopping and Range of Ions in Solids (Pergamon Publishers, New York, 1985).Google Scholar
13. Lee, H. Y. and Chang, H. Y., Philos. Mag. B67, 97 (1993).Google Scholar
14. Ommen, A. H. van, Ottenheim, J. J. M., Theunissen, A. M. L. and Mouwen, A. G., Appl. Phys. Lett. 53, 669 (1988).Google Scholar