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Grain Orientation Mapping and Spatially Resolved Strain Measurements for Polycrystalline Films by X-Ray Microdiffraction

Published online by Cambridge University Press:  15 February 2011

P.-C. Wang ,
G. S. Cargill ,
I. C. Noyan  and
E. G. Liniger
P.-C. Wang
Affiliation:
Department of Chemical Engineering, Materials Science, and Mining Engineering, Columbia University, New York, NY 10027
G. S. Cargill
Affiliation:
Department of Chemical Engineering, Materials Science, and Mining Engineering, Columbia University, New York, NY 10027
I. C. Noyan
Affiliation:
IBM Research, Yorktown Heights, NY 10598
E. G. Liniger
Affiliation:
Department of Chemical Engineering, Materials Science, and Mining Engineering, Columbia University, New York, NY 10027
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Abstract

We describe spatially resolved grain orientation mapping of polycrystalline films using a synchrotron-based x-ray microdiffraction system. The system consists of a tapered glass capillary as a white x-ray concentrator, an energy-dispersive solid state detector and an x-y-z sample stage. Two mapping modes are discussed: reciprocal-space mapping and real-space mapping. Information about the orientations of grains within the irradiated volume is determined by reciprocal-space mapping. The locations of grains having a specified orientation are determined by real-space mapping. Examples are shown for blanket films of AI(4 wt.% Cu) 4μm-thick and 0.5μm thick. Results are also shown for 10μm-wide and μm-wide pure lines. X-ray beams of 10inm diameter were used for these measurements. Spatially resolved thermal strain measurements were made for a single 10μm-wide, 200μm-long passivated Al line, and they were found to be consistent with calculations based on equi-biaxial thermal stress within the line.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 403: Symposium I – Polycrystalline Thin Films: Structure, Texture, Properties and Applications II , 1995 , 213
Copyright
Copyright © Materials Research Society 1996

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References

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