Hostname: page-component-848d4c4894-wg55d Total loading time: 0 Render date: 2024-05-22T01:34:37.550Z Has data issue: false hasContentIssue false
  • English
  • Français

Field Emission from Carbon Films Deposited by VHF CVD on Different Substrates

Published online by Cambridge University Press:  10 February 2011

A.I. Kosarev ,
A.S. Abramov ,
A.J. Vinogradov ,
M.V. Shutov ,
T.E. Felter ,
A.N. Andronov  and
S.V. Robozerov
A.I. Kosarev
Affiliation:
A.F.Ioffe Phys-Techn. Inst., S.-Petersburg, 194021RUSSIA
A.S. Abramov
Affiliation:
A.F.Ioffe Phys-Techn. Inst., S.-Petersburg, 194021RUSSIA
A.J. Vinogradov
Affiliation:
A.F.Ioffe Phys-Techn. Inst., S.-Petersburg, 194021RUSSIA
M.V. Shutov
Affiliation:
A.F.Ioffe Phys-Techn. Inst., S.-Petersburg, 194021RUSSIA
T.E. Felter
Affiliation:
Sandia National Laboratories, present address: Lawrence Livermore National Laboratory, CA 94550USA
A.N. Andronov
Affiliation:
Technical University, S.-Petersburg, 194251, RUSSIA
S.V. Robozerov
Affiliation:
A.F.Ioffe Phys-Techn. Inst., S.-Petersburg, 194021RUSSIA
Get access

Abstract

As previously demonstrated, non-diamond carbon (NDC) films deposited at low temperatures 200-300 °C on silicon tips reduced the threshold of field emission. In this paper we will present the results of the study of field emission from flat NDC films prepared by VHF CVD. Emission measurements were performed in a diode configuration at approximately 10−10 Torr. NDC films were deposited on ceramic and on c-Si substrates sputter coated with layers of Ti, Cu, Ni and Pt. The back contact material influences the emission characteristics but not as a direct correlation to work function. A model of field emission from metal-NDC film structures will be discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 558: Symposium B – Flat-Panel Displays and Sensors-Principles, Materials… , 1999 , 595
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES:

1. Nemanich, R.J., Bauman, P.K., Benjamin, M.C., King, S.W., Weide, J. van der, Davis, R.F., Diamond and Related Materials, 5, 790 (1996).Google Scholar
2. Geiss, M.W., Twichell, J.T. and Lyszcarrz, T.M., J.Vac.Sci.Tech., B14, 2060, (1996).Google Scholar
3. Robertson, J., Mat.Res.Symp.Proc., 471, 217, (1997).Google Scholar
4. Burden, A.P., Forest, R., Silva, S.R.P., Sealy, B.J. and Amaratunga, G.A.J., Mat.Res.Symp.Proc., 498, 221 (1998).Google Scholar
5. Milne, W.I., Robertson, J., Satyanarayana, B.S., Hart, A. and Kleinsorge, B., Mat.Res.Symp.Proc., 498, 209, (1998).Google Scholar
6. Kosarev, A.I., Zhirnov, V.V., Vinogradov, A.J., Shutov, M.V., Bormatova, L.V., Givargizov, E.I., and Felter, T.E., MRS Symp.Proc., 509, 139 (1998).Google Scholar
7. Kosarev, A.I., Andronov, A.N., Robozerov, S.V., Felter, T.E., Vinogradov, A.J., Zhirnov, V.V. and Shutov, M.V., IVMC-98, Abstracts, p.265.Google Scholar
8. Handbook on Electrotechnical Materials. Ed. By Kornitskij, J.V. et al. , Leningrad, 1988.Google Scholar