Hostname: page-component-76fb5796d-zzh7m Total loading time: 0 Render date: 2024-04-25T08:27:19.162Z Has data issue: false hasContentIssue false

Fabrication of Ultra-Shallow P+-N and N+-P Junctions by Diffusion From Selectively Deposited, Ion-Implanted and In-Situ Doped Si0.7Ge0.3

Published online by Cambridge University Press:  21 February 2011

D.T. Grider
Affiliation:
North Carolina State University, Department of Electrical and Computer Engineering, Box 7911, Raleigh, NC 27695-7911
M.C. ÖztÜrk
Affiliation:
North Carolina State University, Department of Electrical and Computer Engineering, Box 7911, Raleigh, NC 27695-7911
J.J. Wortman
Affiliation:
North Carolina State University, Department of Electrical and Computer Engineering, Box 7911, Raleigh, NC 27695-7911
G.S. Harris
Affiliation:
North Carolina State University, Department of Materials Science and Engineering, Box 7916, Engineering, Raleigh, NC 27695-7916
D.M. Maher
Affiliation:
North Carolina State University, Department of Materials Science and Engineering, Box 7916, Engineering, Raleigh, NC 27695-7916
Get access

Abstract

Selectively deposited Si0.7Ge0.3 has been investigated as a potential diffusion source for fabricating ultra-shallow junctions in Si. Rapid thermal chemical vapor deposition (RTCVD) was used to selectively deposit Si0.7Ge0.3 on Si using SiH2C12, GeH4, and H2. Both ionimplanted and in-situ doped Si0.7Ge0.3 were considered as a diffusion source for fabricating ultra-shallow junctions. In-situ doping was achieved with B2H6 and PH3 for p-type and n-type doping, respectively. Boron and phosphorus diffusion in ion-implanted Si0.7Ge0.3 was investigated and modeled using SSUPREM4. Diffusion from implanted and in-situ doped Si0.7Ge0.3 in Si was also studied and modeled. Boron diffusivities in Si0.7Ge0.3 were found to be approximately 10 times greater than in Si, while phosphorus diffusivities were over 100 times greater in Si0.7Ge0.3. The faster dopant diffusivities in Si0.7Ge0.3 allow high surface concentration, abrupt diffusion profiles to be formed in Si. Gated, p-n junction diodes with junction depths as shallow as 140Å were fabricated and tested to study the quality of the diffusions from Si0.7Ge0.3.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Schaber, H., Criegern, R.V., and Weitzel, I., Journal of Applied Physics, Vol. 58(11), p. 4036, (1985).Google Scholar
2. Park, K., Batra, S., Banerjee, S., and Lux, G., in Proceedings of the Materials Research Society, Vol. 182, p. 159, (1990).Google Scholar
3. Probst, V., Böhm, H.J., Schaber, H., Oppolzer, H., and Weitzel, I., Solid State Science and Technology, Vol. 135(3), p. 671, (1988).Google Scholar
4. Kapoor, A.K. and Roulston, D.J., PolySi Emitter Bipolar Transistors. IEEE Press, New York, (1989).Google Scholar
5. Wong, S.S., Bradbury, D.R., Chen, D.C., and Chiu, K.Y., in Proceedings of the IEDM-87, p. 634, (1984).Google Scholar
6. Shibata, H., Suizu, Y., S.Samata, Matsuno, T., and Hashimoto, K., in Proceedings of the IEDM-87, p. 590, (1987).Google Scholar
7. Kwong, D.L., Hsieh, T.Y., Jung, K.H., Ting, W., and Lee, S.K., in Proceedings of the SPIE, Vol. 1189, p. 109, (1989).CrossRefGoogle Scholar
8. Sun, S.W., Denning, D., Hayden, J.D., Woo, M., Fitch, J.T., and Kaushik, V., IEEE Transactions on Electron Devices, Vol. 39(7), p. 1711, (1992).CrossRefGoogle Scholar
9. Picone, K., Batra, S., Park, K., Lobo, M., Bhattacharya, S., Lee, J., and Banerjee, S., Presented at Electronic Materials Conference, June 19-21, Boulder, CO, (1991).Google Scholar
10. Grider, D.T., Öztürk, M.C., and Wortman, J.J., in Proceedings of the Electrochemical Society 3rd International Symposium on ULSI Technology, Vol. 91–11, p. 296, (1991).Google Scholar
11. Grider, D.T., Öztürk, M.C., Harris, G.S., Wortman, J.J., and Maher, D. M., (submitted to IEEE Transactions on Electron Devices).Google Scholar
12. Sanganeria, M.K., Oztdirk, M.C., Harris, G., Maher, D.M., Batchelor, D., Wortman, J.J., Zhang, B., and Zhong, Y., in Proceedings of the Electrochemical Society 3rd International Symposium on ULSI. Technology, Vol. 91–11, p. 851, (1991).Google Scholar
13. Zhong, Y.L., Oztdirk, M.C., Grider, D.T., Wortman, J.J., and Littlejohn, M.A., Applied Physics Letters, Vol. 57(20), p. 2092, (1990).Google Scholar
14. Johnson, F.S., Miles, D.S., Grider, D.T., and Wortman, J.J., Journal of Electronic Materials, Vol. 21(8), p. 805, (1992).CrossRefGoogle Scholar
15. Ashburn, S.P., OztUrk, M.C., Wortman, J.J., Harris, G., Honeycutt, J., and Maher, D.M., Journal of Electronic Materials, Vol. 21(1), p. 81, (1992).in Proceedings of the Advanced Metallization for ULSI Applications in 1992, (1992).CrossRefGoogle Scholar
17. Bean, J.C., Sheng, T.T., Feldman, L.C., Fiory, A.T., and Lynch, R.T., Applied Physics Letters, Vol. 44(1), p. 102, (1983).Google Scholar
18. Sanganeria, M.K., Grider, D.T., Oztiirk, M.C., and Wortman, J.J., Journal of Electronic Materials, Vol. 21, No. 1, pp. 6164, (1992).Google Scholar
19. Eversteyn, F.C. and Put, B.H., Journal of the electrochemical Society: Solid State Science and Technology, Vol. 120, No. 1, p. 106, (1973).CrossRefGoogle Scholar
21. Jang, S.M., Liao, K., and Reif, R., submitted to Applied Physics Letters, (1992).Google Scholar