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Fabrication of Nanotips and Microbeams in Antimonide Based Semiconductor Material using Bromine Ion Beam Assisted Etching

Published online by Cambridge University Press:  01 February 2011

B. Krejca
Affiliation:
Photonics Center, Dept. of Physics, University of Massachusetts, Lowell, MA 01854
S.R. Vangala
Affiliation:
Photonics Center, Dept. of Physics, University of Massachusetts, Lowell, MA 01854
K. Krishnaswami
Affiliation:
Photonics Center, Dept. of Physics, University of Massachusetts, Lowell, MA 01854
R. Kolluru
Affiliation:
Photonics Center, Dept. of Physics, University of Massachusetts, Lowell, MA 01854
M. C. Ospina
Affiliation:
Center for Advanced Materials, University of Massachusetts, Lowell, MA 01854
C. Sung
Affiliation:
Center for Advanced Materials, University of Massachusetts, Lowell, MA 01854
W. D. Goodhue
Affiliation:
Photonics Center, Dept. of Physics, University of Massachusetts, Lowell, MA 01854
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Abstract

Antimonide-based compound semiconductors have emerged as the materials of choice for fabricating high-speed low-power electronics and electro-optics for applications requiring miniaturization and portability. In this work Br-IBAE is shown to be an anisotropic antimonide etching technique that is capable of generating novel structures as well as performing standard etching tasks. When etching less than optimally chemical-mechanical polished (111) InSb wafers, sharp-tipped cone structures with tip radii of the order of less than 60 nm are produced. These structures may be ideally suited for the development of field-emission devices, where small tip radii are required for useful emission currents. The anisotropic nature of the IBAE technique allows one to etch channels in the surface at angles up to 70° from perpendicular, making the fabrication of microbeams feasible. Using an angled sample holder, the first etch undercuts the masked beams from one side. The sample is then removed and realigned so as to undercut the beams from the other side. The triangular shaped microbeams are left suspended from either one or both ends. Using a combination of atomic force microscopy and mechanical engineering beam analysis techniques, the elastic parameters of the material can be measured. The microbeams can be aligned along various directions on the surface to investigate anisotropic characteristics. This is particularly important for determining the mechanical characteristics of materials that can only be grown in thin epitaxial layers, such as quaternary antimonide-based compound semiconductors.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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References

1 Dutta, P.S., Bhatt, H.L. and Kumar, V., “Physics and technology of Gallium antimonide: An Emerging Optoelectronic Material,” J. Appl. Phys. 81(9) 58215870 (1997)Google Scholar
2 Cheng, X-C. and Mcgill, T.C., “Near infrared avalanche diodes with bulk Al0.04Ga0.96Sb and GaSb/AlSb superlattice gain layers,” J. of Applied Phys., Vol. 86(8), 45764579 (1999)Google Scholar
3 Lambert, B., Toudic, Y., Baudet, M., Guenais, B., Deveaud, B., Valiente, I., and Simon, J.C., “High reflectivity 1.55μm (Al)GaSb/AlSb Bragg mirror grown by molecular beam epitaxy,” Appl. Phys. Lett., Vol. 64(6), 690691 (1994)Google Scholar
4 Mermelstein, C., Simanowski, S., Mayer, M., Kiefer, R., Schmitz, J., Walther, M., and Wagner, J., “Room temperature low threshold low loss continuous-wave operation of 2.26μm GaInAsSb/AlGaAsSb quantum well laser diodes,” Appl. Phys. Lett., Vol. 77(11), 15811583 (2000)Google Scholar
5 Li, X., Goodhue, W.D., Santeufemio, C., MacCrimmon, R., Allen, L.P., Krishnaswami, K., Bliss, D., and Sung, C., “Gas Cluster Ion Beam Processing of Gallium Antimonide Wafers for surface and sub-surface damage reduction,” Applied Surface Science, Vol. 218, 251258 (2003)Google Scholar
6 Nagy, G., Ahmad, R.U., Levy, M., Osgood, R.M., Manfra, M.J., and Turner, G.W., Appl. Phys. Lett., Vol. 72(11), 1350 (1998)Google Scholar
7 Liu, Z.Y., Hawkins, B., and Keuch, T.F., “Chemical and structural characterization of GaSb(100) surfaces treated by HCl based solutions and annealed in vacuum,” J. Vac. Sci. Technol. B, Vol. 21 (1), 71 (2003)Google Scholar
8 Rossler, J.M., Royter, Y., Mull, D.E., Goodhue, W.D. and Fonstad, C.G., “Bromine Ion-beam assisted etching of InP and GaAs,” J. Vac. Sci. Technol. B 16(3) 10121017 (1998)Google Scholar
9 Goodhue, W.D., Royter, Y., Mull, D.E., Choi, S.S. and Fonstad, C.G., “Bromine ion-beam-assisted etching of III-V semiconductors,” J. of Electron. Mat. 28(4) 364368 (1999)Google Scholar
10 Vangala, S.R., Krejca, B.D., Krishnaswami, K., Dauplaise, H., Qian, X., Ospina, M., Zhu, B., Vaccaro, K., Bliss, D., Sung, C. and Goodhue, W.D., “Preparation and Patterning of GaSb Surfaces with Br-IBAE for Antimonide Based Molecular Beam Epitaxy,” submitted to Mat. Res. Symp. Proc. (2003)Google Scholar
11 Ospina, M., Vangala, S.R., Yang, D., Sung, C., and Goodhue, W.D., “Micormechanical characterization of GaSb by microbeam defelction and using nanoprobe and finite element analysis,” submitted to Mat. Res. Symp. Proc. (2003)Google Scholar
12 Baptist, R., Bachelet, F., and Constancias, C., “Micortips and resistive sheet: A theoretical description of the missive properties of this system,” J. Vac. Sci. Technol. B, Vol. 15(2), 385390 (1997)Google Scholar