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Fabrication of 2-D and 3-D Photonic Bandgap Structures Using Laser-assisted Imprinting of Self-assembled Particles

Published online by Cambridge University Press:  15 March 2011

Y.F. Lu
Affiliation:
Department of Electrical Engineering, the University of Nebraska-Lincoln, NE 68588-0511 Tel: (402) 472-8323, Fax: (402) 472-4732, Email: ylu2@unl.edu
L.P. Li
Affiliation:
Department of Electrical Engineering, the University of Nebraska-Lincoln, NE 68588-0511, Tel: (402) 472-8323, Fax: (402) 472-4732
K.K. Mendu
Affiliation:
Department of Electrical Engineering, the University of Nebraska-Lincoln, NE 68588-0511, Tel: (402) 472-8323, Fax: (402) 472-4732
J. Shi
Affiliation:
Department of Electrical Engineering, the University of Nebraska-Lincoln, NE 68588-0511, Tel: (402) 472-8323, Fax: (402) 472-4732
D.W. Doerr
Affiliation:
Department of Electrical Engineering, the University of Nebraska-Lincoln, NE 68588-0511, Tel: (402) 472-8323, Fax: (402) 472-4732
D.R. Alexander
Affiliation:
Department of Electrical Engineering, the University of Nebraska-Lincoln, NE 68588-0511, Tel: (402) 472-8323, Fax: (402) 472-4732
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Abstract

Fabrication of 2-D and 3-D photonic bandgap (PBG) structures on silicon substrates using laser-assisted nanoimprinting of silica particles has been investigated. Monolayers of silica particles, with different diameters ranging from 160 nm to 5 νm, were deposited on silicon substrates by self-assembly. A quartz plate, which is transparent to the laser wavelength of 248 nm, was tightly placed on the substrate surface. A KrF excimer laser beam with the wavelength of 248 nm was vertically irradiated on the quartz/nanoparticle/silicon structure. The silica particles were imprinted into silicon substrates by the quartz to form a 2-D PBG structure due to the transient Si surface melting during the laser pulse. 3-D PBG structures can be fabricated by directly imprinting multilayer self-assembled silica particles into Si substrates. They can also be fabricated by repeating a process cycle of silica nanoparticles self-assembly, amorphous Si layer deposition, and simultaneous laser melting, imprinting and recrystallization.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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